多层互连中电迁移的三维动力学蒙特卡罗模拟

2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Pub Date : 2019-09-01 DOI:10.1109/SISPAD.2019.8870540

Linlin Cai, Wangyong Chen, Xing Zhang, Yudi Zhao, Xiaoyan Liu

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引用次数: 3

摘要

基于所提出的金属离子活化、跳变和聚集等物理机制，开发了三维动力学蒙特卡罗模拟器来描述多层互连中的电迁移行为。在仿真机上实现了电子风、静水应力和焦耳热对电磁的影响。模拟结果较好地再现了电流上游和下游两个方向上的空洞位置，与实验结果一致。在不同的操作方案下，研究了微孔形貌和电磁降解。

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3D Kinetic Monte Carlo Simulation of Electromigration in Multi-layer Interconnects

A 3D kinetic Monte Carlo simulator is developed to describe the electromigration (EM) behaviors in multi-layer interconnects based on the proposed physical mechanism including the metal ions activation, hopping and aggregation processes. The effects of e-wind, hydrostatic stress and Joule heat on EM are implemented in the simulator. The void locations in two directions of upstream and downstream current flow are well reproduced by the simulator, consistent with the experimental observations. The microscopic void morphology and EM degradation are investigated with different operation schemes.

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2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

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