利用高效液相色谱法了解光刻胶与电镀液的相互作用

I. Popova, R. Dieckmann, N. Schroeder, G. Gomes, J. Golden
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引用次数: 0

摘要

随着先进封装所需的设计和集成流程范围的迅速扩大,铸造厂和osat都在评估用于增材制造的新型材料——这与抗蚀材料和电镀液尤其相关。这个问题远不是新的(1),它是新包装集成方案中定期要求的工艺-材料相互作用(2)的重新评估的一部分,由设计、工艺流程和技术要求的变化驱动。随着人们对镀液寿命和镀层性能的要求越来越高,材料供应商的动机是尽量减少镀液化学物质和光抗蚀剂之间的相互作用,从而定义镀层图案。在本研究中,我们评估了几个因素的影响,包括抗蚀剂类型(即正极、负极、通用型与“电镀/封装”型)以及抗蚀剂和镀液材料的工艺参数(通过比较不同制造商在硅片上具有不同加工条件的几种抗蚀剂材料)。在本研究中,我们使用反相高效液相色谱与紫外检测作为选择的方法来比较抗蚀剂提取液到电浴中。我们采用镀铜封装型电镀液作为代表性的镀液材料。我们通过高效液相色谱法对提取物进行了半定量评估,以比较其抗蚀性能,并进一步尝试推断抗蚀稳定性和破坏程度,以及对浴液寿命的可能影响。这里开发的方法的实用性允许比较和定量(注意-评估是半定量的,因为不存在浸出成分的标准溶液)通过高效液相色谱法(高效液相色谱法)提取,可以更好地理解抗蚀剂浴液稳定性“因素”,并且可以进一步扩展为在线方法,用于检测光刻胶浴液污染的早期迹象。它还可以用于帮助光刻工更好地预评估光刻胶的能力,并帮助选择未来电镀应用的材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Understanding photoresist - electroplating bath interactions using HPLC methodology
With the rapidly expanding range of design and integration flows required for advanced packaging, both foundries and OSATs alike are evaluating new types of materials for additive manufacturing - this is especially pertinent for both resist materials and galvanic plating baths. This problem is far from new (1), it is a part of the regularly required re-evaluation of process-material interactions (2) for the new packaging integration schemes, driven by changes in design, process flow, and technology requirements. With increasing demands for bath longevity and robustness of plating performance, material vendors are motivated to minimize interactions between the plating bath chemistries and photoresists, defining the plating pattern. In this study, we have evaluated the effect of several factors including - resist type (i.e. positive, negative, general-purpose vs “plating/packaging” type) and process parameters for both resist and bath material (by comparing several resist materials from different manufacturers with varying processing conditions on silicon wafers). We used reverse phase HPLC with UV-detection as a method of choice in this study to compare resist extractables into the galvanic baths. We utilized a copper plating packaging type galvanic bath as a representative bath material. We evaluated semi-quantitatively the extractable via their HPLC signature into the bath to compare resist properties and further attempt to extrapolate resist stability and breakdown magnitude with possible effects on bath life. The utility of the method developed here allows for comparing and quantifying (note - evaluation is semi-quantitative since no standard solutions of leached components exist) extractables via HPLC (high-performance liquid chromatography) allows for a better understanding of resist bath stability “factors”, and can be further expanded into an online method for detecting early signs of bath contamination by a photoresist. It can also be used for aiding lithographers to better pre-assess photoresist capabilities and aid in the material selection for future plating applications.
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