聚对二甲苯在空间电子应用中的介电材料

F. Selbmann, M. Baum, M. Wiemer, Y. Joseph, T. Otto
{"title":"聚对二甲苯在空间电子应用中的介电材料","authors":"F. Selbmann, M. Baum, M. Wiemer, Y. Joseph, T. Otto","doi":"10.1109/ECTC.2018.00331","DOIUrl":null,"url":null,"abstract":"A necessary coating for so called double layer isolation for electronic boards in space applications is presented within this paper. A Parylene F layer with a certain thickness shall realize the second electrical isolation according to the double isolation requirements of the research project. Parylene encapsulation and isolation is one approach to improve the performance and functionalities of electronic and micro systems. By using such kind of innovative and outstanding materials new application fields will be explored, requiring new materials with advanced properties.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"16 1","pages":"2205-2210"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Parylene as a Dielectric Material for Electronic Applications in Space\",\"authors\":\"F. Selbmann, M. Baum, M. Wiemer, Y. Joseph, T. Otto\",\"doi\":\"10.1109/ECTC.2018.00331\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A necessary coating for so called double layer isolation for electronic boards in space applications is presented within this paper. A Parylene F layer with a certain thickness shall realize the second electrical isolation according to the double isolation requirements of the research project. Parylene encapsulation and isolation is one approach to improve the performance and functionalities of electronic and micro systems. By using such kind of innovative and outstanding materials new application fields will be explored, requiring new materials with advanced properties.\",\"PeriodicalId\":6555,\"journal\":{\"name\":\"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"16 1\",\"pages\":\"2205-2210\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2018.00331\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2018.00331","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文介绍了用于空间应用的电子电路板的所谓双层隔离的必要涂层。根据研究项目的双重隔离要求,采用一定厚度的聚对二甲苯F层实现二次电气隔离。聚对二甲苯封装和隔离是提高电子和微系统性能和功能的一种方法。通过使用这些创新和优秀的材料,将探索新的应用领域,需要具有先进性能的新材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Parylene as a Dielectric Material for Electronic Applications in Space
A necessary coating for so called double layer isolation for electronic boards in space applications is presented within this paper. A Parylene F layer with a certain thickness shall realize the second electrical isolation according to the double isolation requirements of the research project. Parylene encapsulation and isolation is one approach to improve the performance and functionalities of electronic and micro systems. By using such kind of innovative and outstanding materials new application fields will be explored, requiring new materials with advanced properties.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信