代工TSV集成与制造挑战

S. Gong, Wei Liu, Juan Boon Tan, Mahesh Bhatkar, H. Cong, J. Oswald, E. Lo, S. Siah
{"title":"代工TSV集成与制造挑战","authors":"S. Gong, Wei Liu, Juan Boon Tan, Mahesh Bhatkar, H. Cong, J. Oswald, E. Lo, S. Siah","doi":"10.1109/IITC.2014.6831840","DOIUrl":null,"url":null,"abstract":"Foundry integration and manufacturing challenges for 2.5D TSV technology are discussed, with focus on in-line defectivity and warpage control. The major defect types and yield correlation are scrutinized. The results show that Cu out-diffusion from TSV due to oxide liner isolation defects has a bigger impact on yield compared to open TSV. The model suggests that one redundant TSV is enough to mitigate open and leakage risks. Interposer warpage behavior is also discussed. It can be influenced by related TSV process modules and optimization can be achieved to minimize the stress induced failures at wafer and die assembly levels. In-line defectivity, wafer warpage and electrical monitoring are essential for yield projection and manufacturing consistency.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Foundry TSV integration and manufacturing challenges\",\"authors\":\"S. Gong, Wei Liu, Juan Boon Tan, Mahesh Bhatkar, H. Cong, J. Oswald, E. Lo, S. Siah\",\"doi\":\"10.1109/IITC.2014.6831840\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Foundry integration and manufacturing challenges for 2.5D TSV technology are discussed, with focus on in-line defectivity and warpage control. The major defect types and yield correlation are scrutinized. The results show that Cu out-diffusion from TSV due to oxide liner isolation defects has a bigger impact on yield compared to open TSV. The model suggests that one redundant TSV is enough to mitigate open and leakage risks. Interposer warpage behavior is also discussed. It can be influenced by related TSV process modules and optimization can be achieved to minimize the stress induced failures at wafer and die assembly levels. In-line defectivity, wafer warpage and electrical monitoring are essential for yield projection and manufacturing consistency.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2014.6831840\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2014.6831840","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

讨论了2.5D TSV技术的铸造集成和制造挑战,重点是在线缺陷和翘曲控制。对主要缺陷类型和良率的相关性进行了详细分析。结果表明,由于氧化衬板隔离缺陷导致的Cu向外扩散对TSV产率的影响比开放TSV更大。该模型表明,一个冗余的TSV足以减轻打开和泄漏的风险。还讨论了中间体翘曲行为。它可以受到相关TSV工艺模块的影响,并且可以实现优化,以最大限度地减少晶圆和模具组装水平的应力引起的故障。在线缺陷、晶圆翘曲和电气监控对良率预测和制造一致性至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Foundry TSV integration and manufacturing challenges
Foundry integration and manufacturing challenges for 2.5D TSV technology are discussed, with focus on in-line defectivity and warpage control. The major defect types and yield correlation are scrutinized. The results show that Cu out-diffusion from TSV due to oxide liner isolation defects has a bigger impact on yield compared to open TSV. The model suggests that one redundant TSV is enough to mitigate open and leakage risks. Interposer warpage behavior is also discussed. It can be influenced by related TSV process modules and optimization can be achieved to minimize the stress induced failures at wafer and die assembly levels. In-line defectivity, wafer warpage and electrical monitoring are essential for yield projection and manufacturing consistency.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信