代工TSV集成与制造挑战

S. Gong, Wei Liu, Juan Boon Tan, Mahesh Bhatkar, H. Cong, J. Oswald, E. Lo, S. Siah
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引用次数: 3

摘要

讨论了2.5D TSV技术的铸造集成和制造挑战,重点是在线缺陷和翘曲控制。对主要缺陷类型和良率的相关性进行了详细分析。结果表明,由于氧化衬板隔离缺陷导致的Cu向外扩散对TSV产率的影响比开放TSV更大。该模型表明,一个冗余的TSV足以减轻打开和泄漏的风险。还讨论了中间体翘曲行为。它可以受到相关TSV工艺模块的影响,并且可以实现优化,以最大限度地减少晶圆和模具组装水平的应力引起的故障。在线缺陷、晶圆翘曲和电气监控对良率预测和制造一致性至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Foundry TSV integration and manufacturing challenges
Foundry integration and manufacturing challenges for 2.5D TSV technology are discussed, with focus on in-line defectivity and warpage control. The major defect types and yield correlation are scrutinized. The results show that Cu out-diffusion from TSV due to oxide liner isolation defects has a bigger impact on yield compared to open TSV. The model suggests that one redundant TSV is enough to mitigate open and leakage risks. Interposer warpage behavior is also discussed. It can be influenced by related TSV process modules and optimization can be achieved to minimize the stress induced failures at wafer and die assembly levels. In-line defectivity, wafer warpage and electrical monitoring are essential for yield projection and manufacturing consistency.
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