机械和热载荷作用下无铅阵列封装的二级互连可靠性系统研究

Hongbin Shi, Daquan Yu, T. Ueda
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引用次数: 4

摘要

便携式设备的无铅(LF)焊点在运输、处理和使用过程中经常受到无意的跌落、弯曲、剪切和热循环载荷的影响。为了应对这些挑战,电子工业广泛采用了各种底填方式,但上述方法存在材料成本高、制造装配率低、可返工性差等内在缺点。为了减少常规底填工艺的周期时间和成本,研究人员开发了两种有前途的聚合物增强技术,即所谓的边缘和角粘合粘合剂,用于下一代阵列封装(ABP)的应用。本文采用包板互连剪切、单调4点弯曲、90°自由落差和热循环试验,系统研究了边角键合LF封装可堆叠极薄细间距球栅阵列(PSvfBGAs)的二级互连可靠性。本研究使用的三种材料分别是紫外光固化丙烯酸边胶(EBA)、热固化环氧树脂EBA和热固化环氧树脂角胶(CBA)。此外,还测试了无键合的PSvfBGAs进行比较。试验结果表明,所有粘结材料均能提高sli的力学性能,尤其是跌落可靠性。相反,边粘接丙烯酸和环氧树脂的PSvfBGAs的热疲劳寿命分别降低了38.42%和8.34%。对比了4个试验组的最大剪切力和弯曲力、十字位移、主应变、跌落和热循环的破坏规律,分析了不同试验条件下sli的破坏模式和破坏机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Systematic studies of second level interconnection reliability of edge and corner bonded lead-free array-based packages under mechanical and thermal loading
Lead-free (LF) solder joints of portable devices are frequently subjected to unintentional drop, bend, shear and thermal cycling loading during transportation, handling, and usage. Various underfills are widely used in the electronics industry to deal with these challenges, however, the above approaches have some intrinsic shortcomings such as high material costs, low manufacturing assembly rate, poor reworkability and so on. To reduce the cycle time and cost of conventional underfill process, two promising polymeric reinforcement technologies for the next generation array-based package (ABP) application, the so-called edge and corner bond adhesives, have been developed. In this paper, the second level interconnection (SLI) reliability of edge and corner bonded LF package stackable very thin fine pitch ball grid arrays (PSvfBGAs) was systematic studied using package to board interconnection shear, monotonic 4-point bend, 90° free-drop, and thermal cycling tests. Three materials used in this study were a UV-cured acrylic edge bond adhesive (EBA), and thermal-cured epoxy EBA, and a thermal-cured epoxy corner bond adhesive (CBA). Moreover, the PSvfBGAs without bonding were also tested for comparison. The test results indicate that all the bonding materials increase the mechanical performance of SLIs, especially for drop reliability. On the contrary, the thermal fatigue lives of PSvfBGAs with edge bond acrylic and epoxy are reduced by 38.42% and 8.34%, respectively. In addition to the comparison of maximum shear and bend forces, crosshead displacement, principle strain, drops and thermal cycles to failure between the four test groups, the failure modes and mechanisms of SLIs under various test conditions were analyzed as well.
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