湿-热-机械应力对叠片封装可靠性的影响

W. Zhu, P. Lai, Shaohua Yang
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引用次数: 5

摘要

集成电路(IC)塑料封装中环氧成型化合物的吸湿性能对其机械可靠性有很大影响。本文研究了两层叠合模封装的湿热效应,重点研究了吸湿应力和热失配应力。通过有限元分析,模拟计算了湿热环境下的水分扩散、热-机械应力、热-机械应力和热-机械应力的分布。模拟结果表明,在85°C /85% RH条件下进行水分预处理后,底部模贴承受较高的热应力。通过对回流过程中吸湿膨胀应力的模拟,指出封装可靠性的关键位置位于底模的转角和底模与模具的连接处。因此,在湿热环境下,底层的可靠性相对较低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of hygro-thermo-mechanical stress on reliability of stacked die package
Mechanical reliability of epoxy molding compounds in plastic packages of integrated circuits (IC) is greatly affected by the compound ability to absorb moisture. In this paper, the hygro-thermal effect of a 2-layer stacked die package was investigated which emphasized on the hygroscopic stress and thermal mismatch stress. By finite element analysis (FEA), the distribution of moisture diffusion, thermo-mechanical stress, hygro-mechanical stress and hygro-thermo-mechanical stress under hygro-thermal environment were simulated and calculated. The simulation results showed that the bottom die-attach endured higher thermal stress after the moisture preconditioning under 85°C /85% RH. By simulation of hygroscopic swelling stress during reflow process, it was indicated that the critical position for the package reliability located at the corner of the bottom die and the interface between the bottom die-attach and die. Therefore, the reliability of the bottom layers is relatively low under hygro-thermal environment.
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