{"title":"考虑材料界面不连续的电子封装中水分扩散的改进有限元建模","authors":"Lulu Ma, R. Joshi, Keith Keith Newman, Xuejun Fan","doi":"10.1109/ECTC.2019.00127","DOIUrl":null,"url":null,"abstract":"The modeling of moisture diffusion plays an important role for the integrity and reliability of electronic packages. In this paper, a new normalization approach and its implementation using ANSYS finite element analysis software are presented. Such an approach can solve the diffusion problem with varying temperature and humidity. Two different options in moisture diffusion modeling provided by ANSYS are discussed. As a validation, the numerical results are compared to that using the conventional normalization approach.","PeriodicalId":6726,"journal":{"name":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","volume":"108 1","pages":"806-810"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Improved Finite Element Modeling of Moisture Diffusion Considering Discontinuity at Material Interfaces in Electronic Packages\",\"authors\":\"Lulu Ma, R. Joshi, Keith Keith Newman, Xuejun Fan\",\"doi\":\"10.1109/ECTC.2019.00127\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The modeling of moisture diffusion plays an important role for the integrity and reliability of electronic packages. In this paper, a new normalization approach and its implementation using ANSYS finite element analysis software are presented. Such an approach can solve the diffusion problem with varying temperature and humidity. Two different options in moisture diffusion modeling provided by ANSYS are discussed. As a validation, the numerical results are compared to that using the conventional normalization approach.\",\"PeriodicalId\":6726,\"journal\":{\"name\":\"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"108 1\",\"pages\":\"806-810\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2019.00127\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2019.00127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improved Finite Element Modeling of Moisture Diffusion Considering Discontinuity at Material Interfaces in Electronic Packages
The modeling of moisture diffusion plays an important role for the integrity and reliability of electronic packages. In this paper, a new normalization approach and its implementation using ANSYS finite element analysis software are presented. Such an approach can solve the diffusion problem with varying temperature and humidity. Two different options in moisture diffusion modeling provided by ANSYS are discussed. As a validation, the numerical results are compared to that using the conventional normalization approach.
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