{"title":"感应加热形成BGA焊料球","authors":"V. Lanin, Ivan I. Sergachou, Vitaly T. Khotskin","doi":"10.12983/IJSRK-2014-P0022-0027","DOIUrl":null,"url":null,"abstract":"Induction devices with open magnetic circuit are efficient for forming solder balls from solder paste on contact pads PCB. Local distribution of eddy currents in solder balls it is possible to provide by optimize frequency and amplitude of the excitation current in inductor. Realization of the high-speed induction heating solder balls in frequencies range from 500 to 1000 kHz are suitable in the magnetic circuit gap of inductor device.","PeriodicalId":14310,"journal":{"name":"International Journal of Scientific Research in Knowledge","volume":"1 1","pages":"22-27"},"PeriodicalIF":0.0000,"publicationDate":"2014-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"BGA Solder Balls Formation by Induction Heating\",\"authors\":\"V. Lanin, Ivan I. Sergachou, Vitaly T. Khotskin\",\"doi\":\"10.12983/IJSRK-2014-P0022-0027\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Induction devices with open magnetic circuit are efficient for forming solder balls from solder paste on contact pads PCB. Local distribution of eddy currents in solder balls it is possible to provide by optimize frequency and amplitude of the excitation current in inductor. Realization of the high-speed induction heating solder balls in frequencies range from 500 to 1000 kHz are suitable in the magnetic circuit gap of inductor device.\",\"PeriodicalId\":14310,\"journal\":{\"name\":\"International Journal of Scientific Research in Knowledge\",\"volume\":\"1 1\",\"pages\":\"22-27\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Scientific Research in Knowledge\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.12983/IJSRK-2014-P0022-0027\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Scientific Research in Knowledge","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.12983/IJSRK-2014-P0022-0027","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Induction devices with open magnetic circuit are efficient for forming solder balls from solder paste on contact pads PCB. Local distribution of eddy currents in solder balls it is possible to provide by optimize frequency and amplitude of the excitation current in inductor. Realization of the high-speed induction heating solder balls in frequencies range from 500 to 1000 kHz are suitable in the magnetic circuit gap of inductor device.
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