{"title":"不同尺寸可控硅整流器ESD防护研究","authors":"Yize Wang, Junmin He, Y. Hu, Yubo Wang, Yuan Wang","doi":"10.1109/ICSICT49897.2020.9278319","DOIUrl":null,"url":null,"abstract":"This work mainly shows the impact of dimension changes of silicon controlled rectifier (SCR) devices on ESD protection. Based on 110-nm technology node, the key parameters D1, D2, and D3 of SCR device are variable to obtain the relevant measurement. Further, the detail analysis from the perspective of high-voltage application for these measured results are summarized in this work.","PeriodicalId":6727,"journal":{"name":"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)","volume":"3 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Study of Silicon Controlled Rectifier Devices with Different Dimensions for ESD Protection\",\"authors\":\"Yize Wang, Junmin He, Y. Hu, Yubo Wang, Yuan Wang\",\"doi\":\"10.1109/ICSICT49897.2020.9278319\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work mainly shows the impact of dimension changes of silicon controlled rectifier (SCR) devices on ESD protection. Based on 110-nm technology node, the key parameters D1, D2, and D3 of SCR device are variable to obtain the relevant measurement. Further, the detail analysis from the perspective of high-voltage application for these measured results are summarized in this work.\",\"PeriodicalId\":6727,\"journal\":{\"name\":\"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)\",\"volume\":\"3 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSICT49897.2020.9278319\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT49897.2020.9278319","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study of Silicon Controlled Rectifier Devices with Different Dimensions for ESD Protection
This work mainly shows the impact of dimension changes of silicon controlled rectifier (SCR) devices on ESD protection. Based on 110-nm technology node, the key parameters D1, D2, and D3 of SCR device are variable to obtain the relevant measurement. Further, the detail analysis from the perspective of high-voltage application for these measured results are summarized in this work.