一种用于低Dk覆铜层压板的新型树脂组成

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382128

June-Che Lu, Yeong-Tong Hwang

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引用次数: 1

摘要

近年来，高频信号传输已广泛应用于通信和宽带技术，甚至在微型电子设备中。当信号高速传输时，如何保持信号的完整性成为一个重要的问题。因此，印制电路板用层压板材料的介电常数(Dk)和损耗因子(Df)的电性能越来越受到人们的关注。在我们新开发的含有环氧树脂的组合物中，环氧树脂在聚合物链中具有低极性的分子段，该分子段由对称和饱和的环脂肪族结构组成。该结构将降低环氧树脂的偶极矩，从而使含环氧树脂的组合物生产的覆铜层压板具有低Dk和低Df

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A novel resin composition for low Dk copper clad laminate

Recently, high frequency signal transmission has been widely used in communication and broadband technologies, and even in mini-electronic devices. When signals travel at a high speed, how to maintain signal integrity becomes an important issue. Therefore, the electric properties in terms of dielectric constant (Dk) and loss factor (Df) of laminate materials for PCB production are more and more concerned. In our newly developed composition containing an epoxy resin, the epoxy resin has a molecular segment with low polarity in the polymer chain where the molecular segment is composed of a structure derived from a symmetric and saturated cycloaliphatic. The structure will reduce the dipole moment of the epoxy resin, so that the copper clad laminate produced from the composition containing the epoxy resin can have a low Dk and low Df

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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