700℃退火纳米结构GeSi薄膜的电学行为

A. Lepadatu, I. Stavarache, A. Maraloiu, C. Palade, T. V. Serban, C. L. Magdalena
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引用次数: 2

摘要

在本文中,我们继续对纳米结构GexSi1-x薄膜的研究。采用磁控溅射法制备薄膜,并在700℃的N2气氛中退火。研究了它们的结构和电学行为。为此,使用了常规和高分辨率透射电子显微镜以及选定区域电子衍射。对电流-电压和电流-温度曲线进行了电学测量。形成薄膜的大多数晶体的成分为Ge50Si50,尺寸为15- 30nm。I-T特征具有Arrhenius依赖性,两个活化能解释为量子限制能级之间的跃迁。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical behaviour related to structure of nanostructured GeSi films annealed at 700°C
In this paper we continue the previous investigations on nanostructured GexSi1-x films. The films were deposited by magnetron sputtering and annealed in N2 atmosphere at 700 °C. Their structure was investigated and correlated with the electrical behavior. For this, conventional and high-resolution transmission electron microscopy together with selected area electron diffraction was used. Electrical measurements of current-voltage and current-temperature curves were made. The majority of crystallites that forms the films have the composition Ge50Si50 and 15-30 nm size. The I-T characteristics have Arrhenius dependence, with two activation energies interpreted as transitions between quantum confinement levels.
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