{"title":"采用混合晶圆键合和过孔TSV工艺的三维集成技术","authors":"K. Takeda, M. Aoki","doi":"10.1109/IITC.2014.6831872","DOIUrl":null,"url":null,"abstract":"A three-layer-stacked wafer with CMOS devices was fabricated by using hybrid wafer bonding and backside-via-last TSV (7-μm diameter/25-μm length) processes. Successful fabrication of this wafer confirmed that copper/polymer hybrid wafer bonding brings seamless copper bonding in face-to-face (F2F) and back-to-face (B2F) configurations. The low capacitance of the TSVs results in the highest level of transmission performance (15 Tbps/W) so far. Additionally, according to ring-oscillator measurements, the keep-out-zone (KOZ) is up to 2 μm from a TSV. This extremely small KOZ is mainly attributed to low residual stress in the silicon surrounding a TSV.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"3D integration technology using hybrid wafer bonding and via-last TSV process\",\"authors\":\"K. Takeda, M. Aoki\",\"doi\":\"10.1109/IITC.2014.6831872\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A three-layer-stacked wafer with CMOS devices was fabricated by using hybrid wafer bonding and backside-via-last TSV (7-μm diameter/25-μm length) processes. Successful fabrication of this wafer confirmed that copper/polymer hybrid wafer bonding brings seamless copper bonding in face-to-face (F2F) and back-to-face (B2F) configurations. The low capacitance of the TSVs results in the highest level of transmission performance (15 Tbps/W) so far. Additionally, according to ring-oscillator measurements, the keep-out-zone (KOZ) is up to 2 μm from a TSV. This extremely small KOZ is mainly attributed to low residual stress in the silicon surrounding a TSV.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2014.6831872\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2014.6831872","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D integration technology using hybrid wafer bonding and via-last TSV process
A three-layer-stacked wafer with CMOS devices was fabricated by using hybrid wafer bonding and backside-via-last TSV (7-μm diameter/25-μm length) processes. Successful fabrication of this wafer confirmed that copper/polymer hybrid wafer bonding brings seamless copper bonding in face-to-face (F2F) and back-to-face (B2F) configurations. The low capacitance of the TSVs results in the highest level of transmission performance (15 Tbps/W) so far. Additionally, according to ring-oscillator measurements, the keep-out-zone (KOZ) is up to 2 μm from a TSV. This extremely small KOZ is mainly attributed to low residual stress in the silicon surrounding a TSV.
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