{"title":"一种新型面外电热双稳态微执行器","authors":"Liang Zhou, Huikai Xie","doi":"10.1109/TRANSDUCERS.2019.8808360","DOIUrl":null,"url":null,"abstract":"This paper reports an out-of-plane bistable electrothermal microactautor that is comprised of inverted-series-connected (ISC) Cu/W-based multimorphs. S-shaped ISC multimorphs have been previously employed for generating large vertical displacement. In this work, the ISC multimorphs have been engineered into a warped shape via pre-stressed W and unbalanced SiO2 encapsulation layers. Electrothermal bistable actuators based on the warped ISC multimorphs have been fabricated and tested. A bistable vertical displacement of 25 μm has been obtained.","PeriodicalId":6672,"journal":{"name":"2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)","volume":"125 1","pages":"1953-1956"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Novel Out-of-Plane Electrothermal Bistable Microactuator\",\"authors\":\"Liang Zhou, Huikai Xie\",\"doi\":\"10.1109/TRANSDUCERS.2019.8808360\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports an out-of-plane bistable electrothermal microactautor that is comprised of inverted-series-connected (ISC) Cu/W-based multimorphs. S-shaped ISC multimorphs have been previously employed for generating large vertical displacement. In this work, the ISC multimorphs have been engineered into a warped shape via pre-stressed W and unbalanced SiO2 encapsulation layers. Electrothermal bistable actuators based on the warped ISC multimorphs have been fabricated and tested. A bistable vertical displacement of 25 μm has been obtained.\",\"PeriodicalId\":6672,\"journal\":{\"name\":\"2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)\",\"volume\":\"125 1\",\"pages\":\"1953-1956\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-06-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TRANSDUCERS.2019.8808360\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TRANSDUCERS.2019.8808360","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Novel Out-of-Plane Electrothermal Bistable Microactuator
This paper reports an out-of-plane bistable electrothermal microactautor that is comprised of inverted-series-connected (ISC) Cu/W-based multimorphs. S-shaped ISC multimorphs have been previously employed for generating large vertical displacement. In this work, the ISC multimorphs have been engineered into a warped shape via pre-stressed W and unbalanced SiO2 encapsulation layers. Electrothermal bistable actuators based on the warped ISC multimorphs have been fabricated and tested. A bistable vertical displacement of 25 μm has been obtained.