磷对无铅BGA焊点的影响及失效机理研究

Ming Sun, Muh-ren Lin, T. Chaudhry, R. Lutze
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引用次数: 1

摘要

少量的磷(P)经常被添加到球栅阵列(BGA)封装中的无铅焊料球中,作为封装回流过程中的抗氧化剂。结果表明,在无铅焊料中添加磷会导致焊点早期失效。此外,我们还开发了这种现象的失效机制,这是以前没有被理解的。我们的研究表明,在回流过程中,磷在金属间化合物(IMC)区积累,导致在IMC层和BGA球垫Ni层的界面处形成一层薄薄的多孔层。这种薄多孔层对每个焊点的结合强度有不利影响。从扩散、变形诱发应力、晶体结构、热应力和测试环境等因素分析了材料的破坏机理。这些因素提供了关于包装中使用的组件和服务操作条件(温度,时间,机械结构)的包装可靠性的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of phosphorus impact on lead-free BGA solder joint and failure mechanism
Small amounts of phosphorus (P) are often added to lead-free solder balls in ball grid array (BGA) packages to act as an antioxidant during the packaging reflow process. This paper shows that the addition of phosphorus to lead-free solder results in early solder joint failure. Also, we developed the failure mechanism for this phenomenon, which has not previously been understood. Our study shows that the accumulation of phosphorus in the intermetallic compound (IMC) area during the reflow process results in the formation of a thin porous layer at the interface of the IMC layer and the Ni layer of the BGA ball pad. This thin porous layer adversely affects the bond strength of each solder joint. The failure mechanism was developed in terms of factors such as diffusion, deformation-induced stress, crystal structure, thermal stress, and testing environments. Such factors provide an insight into package reliability with regard to the components used in the package and in-service operating conditions (temperature, time, mechanical structure).
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