{"title":"基于流水线游标tdc的4Gbps DPPM片上串行链路","authors":"Jinhao Li, Chongbing Qu, Fan Wu, Jianfei Jiang","doi":"10.1109/ICSICT49897.2020.9278344","DOIUrl":null,"url":null,"abstract":"This paper presents a double-edge Pulse Position Modulation (DPPM) time-domain serial link for on-chip interconnect. The proposed design can achieve highspeed low-power interconnect with a lower operating frequency. The time-to-digital converter (TDC) based receiver is pipelined to achieve a throughput rate of as high as 4Gbps. The overall system is designed and simulated to achieve 4Gbps data rate with 171.2fJ/bit/mm energy dissipation for 10mm on-chip interconnect on 40nm SMIC CMOS process.","PeriodicalId":6727,"journal":{"name":"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)","volume":"39 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A 4Gbps DPPM On-chip Serial Link Based on Pipelined Vernier-Tdc\",\"authors\":\"Jinhao Li, Chongbing Qu, Fan Wu, Jianfei Jiang\",\"doi\":\"10.1109/ICSICT49897.2020.9278344\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a double-edge Pulse Position Modulation (DPPM) time-domain serial link for on-chip interconnect. The proposed design can achieve highspeed low-power interconnect with a lower operating frequency. The time-to-digital converter (TDC) based receiver is pipelined to achieve a throughput rate of as high as 4Gbps. The overall system is designed and simulated to achieve 4Gbps data rate with 171.2fJ/bit/mm energy dissipation for 10mm on-chip interconnect on 40nm SMIC CMOS process.\",\"PeriodicalId\":6727,\"journal\":{\"name\":\"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)\",\"volume\":\"39 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSICT49897.2020.9278344\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSICT49897.2020.9278344","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 4Gbps DPPM On-chip Serial Link Based on Pipelined Vernier-Tdc
This paper presents a double-edge Pulse Position Modulation (DPPM) time-domain serial link for on-chip interconnect. The proposed design can achieve highspeed low-power interconnect with a lower operating frequency. The time-to-digital converter (TDC) based receiver is pipelined to achieve a throughput rate of as high as 4Gbps. The overall system is designed and simulated to achieve 4Gbps data rate with 171.2fJ/bit/mm energy dissipation for 10mm on-chip interconnect on 40nm SMIC CMOS process.