Image transfer solutions for future demand

Ever increasing need for smaller and functionally more integrated electronics devices such as smart phone, IC package substrate is forcing changes in materials for PWB imaging. This paper will provide insights how new materials developments are offering improved capabilities to produce such a high-end, fine-line PWBs along with imaging process considerations. The fabrication processes involved in the production of fine-line printed wiring boards will be also reviewed in some detail, between subtractive processes (which will not meet future needs) and semi-additive processes as well as emerging damascene-type of structure. This paper will highlight an overview of the importance that material and process selection has on the capability of PWB fabricators to meet the challenges in the future and provide insights into future direction based on evolving market needs