高性能40纳米nmosfet与HfO2栅极电介质和多晶硅damascene栅极

B. Tavel, X. Garros, T. Skotnicki, F. Martin, C. Leroux, D. Bensahel, M. Semeria, Y. Morand, J. Damlencourt, S. Descombes, F. Leverd, Y. Le-Friec, P. Leduc, M. Rivoire, S. Jullian, R. Pantel
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引用次数: 10

摘要

我们报道了将HfO/sub - 2/介电介质和多晶硅栅极集成到大马士革结构中的40 nm nMOS晶体管。我们制备了EOT低至15 /spl的HfO/sub - 2/ ALD层,其泄漏电流比SiO/sub - 2/低20多年。在2nm EOT nmosfet上观察到较小的迁移率下降,导致HfO/ sub2 /和polySi电极获得了最佳性能(离子= 680 /spl mu/A//spl mu/m @ Ioff=230 nA//spl mu/m)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High performance 40 nm nMOSFETs with HfO2 gate dielectric and polysilicon damascene gate
We report on 40 nm nMOS transistors with HfO/sub 2/ dielectric and polySi gate integrated into a damascene structure. We fabricated HfO/sub 2/ ALD layers with EOT down to 15 /spl Aring/, exhibiting leakage current more than two decades lower than SiO/sub 2/. Small mobility degradation on 2 nm EOT nMOSFETs was observed leading to the best performances (Ion= 680 /spl mu/A//spl mu/m @ Ioff=230 nA//spl mu/m) ever obtained with HfO/sub 2/ and polySi electrodes.
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