多重穿透薄销加固复合金属杂化节点损伤容限研究

Longquan Liu
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引用次数: 1

摘要

在飞机结构中应用胶粘接技术可以大大降低总重量,但胶粘接接头对服役过程中可能出现的制造缺陷和损伤非常敏感,难以满足当前运输机结构的损伤容限要求。本文研究了复合材料-金属杂化节点的损伤容限问题。在结合区采用多层穿透式薄筋,将薄筋与复合材料和金属连接板粘结在一起,从而提高复合材料-金属连接的损伤容限性能。通过实验试验和有限元模拟,研究了透厚增强对含和不含预制脱粘缺陷接头损伤容限性能的影响。通过对比分析发现,在结合区引入穿透式薄销,可显著提高复合金属结合接头的静载能力、破坏应变、断裂能和疲劳寿命。此外,增强材料还降低了粘结接头对粘结区脱粘缺陷的敏感性。通过试验结果与仿真结果的结合分析,揭示了透渗增强对复合金属粘接接头损伤容限性能的增强机理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A study of the damage tolerance of composite-metal hybrid joints reinforced by multiple and penetrative thin pins
The application of adhesive bonding technology in aircraft structures can reduce the total wight greatly, but the bonded joints are very sensitive to the possible manufacturing defects and damages during service operations, which makes them difficult to meet the damage tolerance requirements of the current transport airplane structures. In this study, the damage tolerance of composite-metal hybrid joints reinforced by multiple and penetrative thin pins was studied. The damage tolerance performance of the composite-metal joint is supposed to be enhanced by multiple through-the-thickness penetrative thin reinforcements in the bonding region, and the thin reinforcements were bonded together with both the composite and metallic joint plates. Both experimental tests and finite element simulations were conducted to investigate the effects of the through-the-thickness reinforcements on the damage tolerance performance of the joints with and without pre-fabricated disbond defects. Through the comparative analyses, it was found that the penetrative thin pins in the bonding region significantly improved the static load carrying capacity, the failure strain, the fracture energy, and the fatigue lives of the composite-metal bonded joints. Moreover, the reinforcements decreased the sensitivity of the bonded joints to the disbond defects in the bonding region. The damage tolerance performance of the composite-metal adhesively bonded joints was significantly increased by the through-the-thickness penetrative reinforcements and the enhancement mechanism was revealed by the combined analysis of test results and simulation results.
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