时效对Sn-9Zn无铅焊料中Cu添加量与Au衬底界面反应的影响

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382122

Wei-Kai Liou, Y. Yen, Chien-Chung Jao

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引用次数: 1

摘要

本文研究了时效对Sn-9wt%Zn-x wt% (SZ-xCu)合金与Au基体界面反应的影响。在160℃时效24小时后，SZ/Au和SZ- 1cu /Au合金中分别形成Au3Zn7/AuZn2/AuZn和Au3Zn7/AuZn相。在SZ-4 Cu/Au界面只发现了AuSn相。时效时间延长至800 h时，Sn成为主导扩散元素。界面处形成二元Au-Sn相和亚稳Au-Zn-Sn三元相Au33-36 Zn35-36Sn29-31。时效效应导致钎料中主导扩散元素和Zn、Cu浓度的变化，是改变SZ-xCu/Au体系IMC形成顺序的主要原因。

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Aging effects on interfacial reactions between Cu addition into the Sn-9Zn lead-free solder and Au substrate

This study investigates aging effects on interfacial reactions between Sn-9wt%Zn-x wt% (SZ-xCu) alloys and Au substrate. The Au3Zn7/AuZn2/AuZn and Au3Zn7/AuZn phases respectively formed in the SZ/Au and SZ-1Cu/Au couples aged at 160°C for 24 hours. Only the AuSn phase was found at the SZ-4 Cu/Au interface. Extending the aging time to 800 hours, Sn became a dominant diffusion element. Binary Au-Sn phases and the metastable Au-Zn-Sn ternary phase, Au33–36 Zn35–36Sn29–31, was formed at the interface. The aging effect causing the changes of dominant diffusion element and concentration of Zn, Cu in the solder is the main reasons to change the sequence of the IMC formation in the SZ-xCu/Au systems.

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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