基于压阻系数的Ge三维晶体管迁移率模型

Kuan-Ting Chen , Ren-Yu He , Yun-Fang Chung , Min-Hsin Hsieh , Shu-Tong Chang
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引用次数: 2

摘要

传统的一阶压阻模型通常用于描述互补金属-氧化物半导体场效应晶体管(CMOS)技术中低水平工艺诱导应力下载流子迁移率的增强。然而,许多报告表明,它未能描述在高水平应力下观察到的非线性行为。本文提出了基于具有9个应力无关压阻系数的修正压阻模型的迁移率模型,从而使迁移率模型能够正确地用于计算应变引起的载流子迁移率变化。因此,与传统的压阻(PR)模型相比,整体精度得到了提高。通过对Ge翅片场效应晶体管(FinFET)和纳米线晶体管载流子迁移率的TCAD仿真结果证实了该方法的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mobility model based on piezoresistance coefficients for Ge 3D transistor

The conventional first order piezoresistance model has commonly been used to describe carrier mobility enhancement for low levels of process induced stress in Complementary Metal-Oxide-Semiconductor Field Effect Transistor (CMOS) technology. However, many reports show it failing to describe the nonlinear behavior observed at high levels of stress. In this paper, mobility model based on the modified piezoresistance model with nine stress-independent piezoresistance coefficients is proposed such that a mobility model can be applied correctly to calculate the strain-induced carrier mobility changes. Hence, the overall accuracy is improved compared to the conventional piezoresistance (PR) model. Its validation is confirmed with the results from TCAD simulations of carrier mobility for Ge Fin Field Effect Transistors (FinFET) and nanowire transistors.

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