{"title":"热循环试验中功率模块焊线疲劳寿命预测","authors":"Yu-Bo Guo, Yangjian Xu, L. Liang, Y. Liu","doi":"10.1109/ICEPT.2016.7583180","DOIUrl":null,"url":null,"abstract":"In this paper, 3-D finite element (FE) models were established to investigate the fatigue lives of bonding wire in different power packages in thermal cycling test. Meanwhile, three types of packages were tested. Bonding wire lift-off and neck failures took place during test, which were caused by the coefficient of thermal expansion (CTE) mismatch between wire and chip. Finally, a strain-based life prediction relation for thermal cycling test was proposed by combining the experiment results with simulation data.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"20 1","pages":"482-485"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Bonding wire fatigue life prediction of power module in thermal cycling test\",\"authors\":\"Yu-Bo Guo, Yangjian Xu, L. Liang, Y. Liu\",\"doi\":\"10.1109/ICEPT.2016.7583180\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, 3-D finite element (FE) models were established to investigate the fatigue lives of bonding wire in different power packages in thermal cycling test. Meanwhile, three types of packages were tested. Bonding wire lift-off and neck failures took place during test, which were caused by the coefficient of thermal expansion (CTE) mismatch between wire and chip. Finally, a strain-based life prediction relation for thermal cycling test was proposed by combining the experiment results with simulation data.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"20 1\",\"pages\":\"482-485\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583180\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583180","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Bonding wire fatigue life prediction of power module in thermal cycling test
In this paper, 3-D finite element (FE) models were established to investigate the fatigue lives of bonding wire in different power packages in thermal cycling test. Meanwhile, three types of packages were tested. Bonding wire lift-off and neck failures took place during test, which were caused by the coefficient of thermal expansion (CTE) mismatch between wire and chip. Finally, a strain-based life prediction relation for thermal cycling test was proposed by combining the experiment results with simulation data.
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