接头尺度Sn1.0Ag0.5Cu焊料剪切试样的蠕变行为

C. Burke, J. Punch, M. Collins
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引用次数: 3

摘要

研究了接头尺度Sn1.0Ag0.5Cu (SAC105)焊料试样在剪切载荷作用下的蠕变行为。该工作的目的是确定这种低银含量三元SAC焊料合金的Anand粘塑性本构模型参数。在20°C、50°C、75°C和100°C的温度下,进行了一系列单调恒剪切应力(5-15MPa)和恒剪切应变速率(1E-6-1E-2 (1/s))试验,为提取本构模型参数提供数据。为了说明拟合优度,将Anand模型的预测结果与实验数据进行了图形化比较。在所有温度和测试条件下,SAC105在较高应变速率下比在较低应变速率下具有更强的抗蠕变性能。所得的Anand参数很好地反映了SAC105焊料在剪切载荷下的蠕变性能,实验数据与Anand预测结果紧密相关。除了对SAC105焊点的力学特性进行量化外,还进行了初步的电子背散射衍射(EBSD)研究,以研究预处理对SAC105焊点晶粒结构的影响。结果表明,预处理过程中钎料晶粒的取向偏差增大,表明钎料晶粒因时效而变粗。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Creep behavior of joint-scale Sn1.0Ag0.5Cu solder shear samples
This study investigates the creep behavior of joint-scale Sn1.0Ag0.5Cu (SAC105) solder samples under shear loading. The objective of the work is to determine the Anand viscoplastic constitutive model parameters for this low silver content ternary SAC solder alloy. A series of monotonic constant shear stress (5-15MPa) and constant shear strain rate (1E-6-1E-2 (1/s)) tests was conducted at temperatures of 20°C, 50°C, 75°C and 100°C in order to provide data to extract the constitutive model parameters. The predictions of the Anand model are compared graphically with the experimental data in order to illustrate goodness-of-fit. SAC105 was found to be more creep resistant at higher strain rates than at lower strain rates for all temperatures and test conditions. The derived Anand parameters are shown to capture the creep performance of the SAC105 solder under shear loading very well, with the experimental data being tightly bound to the Anand predictions. In addition to the quantification of mechanical characteristics, a preliminary Electron Backscatter Diffraction (EBSD) investigation was conducted to investigate the effect of preconditioning on the grain structure of SAC105 solder joints. Results indicate that the misorientaion of the solder grains increased during preconditioning, signaling grain coarsening due to ageing.
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