使用超薄膜PD-SOI技术,栅极长度缩放加速到30 nm

S. Fung, M. Khare, D. Schepis, Woo-Hyeong Lee, S. Ku, H. Park, J. Snare, B. Doris, A. Ajmera, K. Muller, P. Agnello, P. Gilbert, J. Welser
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引用次数: 10

摘要

提出了针对100nm工艺节点设计的高性能SOI CMOS。在1 V电源电压下,33 nm器件的驱动电流为fet的DC(动态)为1000 (1100)/spl mu/ a //spl mu/m,在关闭电流为300 nA//spl mu/m时,fet的驱动电流为445 (457)/spl mu/ a //spl mu/m。固有栅极延迟分别为0.55 ps和1.19 ps。当栅极长度缩放到25 nm时,NFET延迟进一步降低到0.45 ps。在1.0 V时,延迟和电流值是有史以来最好的。在45 nm SOI衬底上采用超光晕设计,取得了优异的效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Gate length scaling accelerated to 30 nm regime using ultra-thin film PD-SOI technology
High performance SOI CMOS designed for the 100 nm technology node is presented. At 1 V supply voltage, the 33 nm devices give a drive current of 1000 (1100) /spl mu/A//spl mu/m DC (dynamic) for NFET and 445 (457) /spl mu/A//spl mu/m for PFET at an off current of 300 nA//spl mu/m. The intrinsic gate delays are 0.55 ps and 1.19 ps. The NFET delay is further reduced to 0.45 ps at gate length scaled to 25 nm. The delay and current values are the best ever reported at 1.0 V. The excellent result is accomplished by using super-HALO design on 45 nm SOI substrate.
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