K. Jacob, S. Ahmadi, F. Wendler, S. Miyazaki, M. Gueltig, M. Kohl
{"title":"基于形状记忆箔的便携式有源微阻尼","authors":"K. Jacob, S. Ahmadi, F. Wendler, S. Miyazaki, M. Gueltig, M. Kohl","doi":"10.1109/TRANSDUCERS.2019.8808494","DOIUrl":null,"url":null,"abstract":"Novel damping devices are presented and characterized that make use of energy dissipation due to the one-way shape memory effect in micromachined shape memory alloy (SMA) foil actuators of 30 µm thickness and lateral dimensions a few mm. The design of SMA foil actuators consists of free-standing planar suspensions with bridge, spiral and folded beam design for load control in-plane and out-of-plane. In contrast to SMA wire-based solutions, this new approach is compatible to MEMS batch fabrication technology. Under pulsed loading, a damping capacity of up to 0.92 is achieved, which compares favorably with the best viscoelastic damping concepts.","PeriodicalId":6672,"journal":{"name":"2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)","volume":"16 1","pages":"590-593"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Shape Memory Foil-Based Active Micro Damping for Portable Applications\",\"authors\":\"K. Jacob, S. Ahmadi, F. Wendler, S. Miyazaki, M. Gueltig, M. Kohl\",\"doi\":\"10.1109/TRANSDUCERS.2019.8808494\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Novel damping devices are presented and characterized that make use of energy dissipation due to the one-way shape memory effect in micromachined shape memory alloy (SMA) foil actuators of 30 µm thickness and lateral dimensions a few mm. The design of SMA foil actuators consists of free-standing planar suspensions with bridge, spiral and folded beam design for load control in-plane and out-of-plane. In contrast to SMA wire-based solutions, this new approach is compatible to MEMS batch fabrication technology. Under pulsed loading, a damping capacity of up to 0.92 is achieved, which compares favorably with the best viscoelastic damping concepts.\",\"PeriodicalId\":6672,\"journal\":{\"name\":\"2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)\",\"volume\":\"16 1\",\"pages\":\"590-593\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-06-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TRANSDUCERS.2019.8808494\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TRANSDUCERS.2019.8808494","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Shape Memory Foil-Based Active Micro Damping for Portable Applications
Novel damping devices are presented and characterized that make use of energy dissipation due to the one-way shape memory effect in micromachined shape memory alloy (SMA) foil actuators of 30 µm thickness and lateral dimensions a few mm. The design of SMA foil actuators consists of free-standing planar suspensions with bridge, spiral and folded beam design for load control in-plane and out-of-plane. In contrast to SMA wire-based solutions, this new approach is compatible to MEMS batch fabrication technology. Under pulsed loading, a damping capacity of up to 0.92 is achieved, which compares favorably with the best viscoelastic damping concepts.