深湿蚀刻通过1mm耐热玻璃晶圆微流体应用

2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2007-01-01 DOI:10.1109/MEMSYS.2007.4433150

C. Iliescu, Bangtao Chen, J. Miao

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引用次数: 22

摘要

本文讨论了与湿法微加工有关的主要问题，并提出了两种深度湿法蚀刻的优化解决方案。利用低应力非晶硅(a: Si)和光刻胶组成的蚀刻掩膜蚀刻了500 mm厚的耐热玻璃晶圆片。此外，我们还报道了使用低应力a: Si/SiC/光刻胶掩膜组合成功蚀刻1mm Pyrex玻璃晶圆。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Deep wet etching-through 1mm pyrex glass wafer for microfluidic applications

This paper addresses the main issues related to wet micromachining of one of the mostly used BioMEMS materials - glass - and proposes two optimized solutions for deep wet etching. As a result, 500 mum-thick Pyrex glass wafer was etched using an etching mask consisting of low stress amorphous silicon (a: Si) and photoresist. Moreover we report the successful through etching of 1 mm Pyrex glass wafer using a combination of low stress a: Si/SiC/photoresist mask.

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2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)

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