Developing a leading practical application for 3D IC chip stacking technology

−1− Synthesiology English edition Vol.9 No.1 pp.1-15 (Jun. 2016) IC technologies, and the attempt to increase the integration density seemed to face the limit. The three-dimensional IC chip stacking technology whereby the IC devices are stacked vertically and packaged is one of the solutions, and expectation for it is rising recently as a technology for semiconductor device stacking that enables the increase of integration density for semiconductor ICs. Therefore, we established the fundamental technology for high-density high-integration electronic hardware construction required for 3D IC chip stacking, and we are working on the R&D of the application phase to create the flow of application system development, while engaging in technical support of massproduction technology that, in practice, should be undertaken by leading companies.