零星早期寿命锡球脱落对晶圆级芯片封装中焊点后续组织演变和疲劳的影响

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2020-01-01 DOI:10.4071/imaps.966816

Simon Schambeck, M. Hutter, J. Jaeschke, A. Deutinger, M. Schneider-Ramelow

引用次数: 0

摘要

电子产品的不断小型化与工业和汽车电子产品对可靠性的苛刻要求相结合，是新兴封装行业面临的一大挑战。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages

Abstract The combination of continuous miniaturization of electronics and the demanding reliability requirements for industrial and automotive electronics is one big challenge for emerging packagin...

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.