Journal of Microelectronics and Electronic Packaging

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1476

历年发表同类期刊

ISSN：

print: 1551-4897
on-line: 1555-8037

研究领域：

Engineering-Electrical and Electronic Engineering

Gold OA文章占比：

0.00%

原创研究文献占比：

0.00%

SCI收录类型：

Scopus (CiteScore)

期刊介绍英文：

The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.

CiteScore：

CiteScore	SJR	SNIP	CiteScore排名
1.3	0.160	0.523	学科排名百分位大类：Engineering 小类：Electrical and Electronic Engineering 608 / 797 23% 大类：Materials Science 小类：Electronic, Optical and Magnetic Materials 229 / 284 19% 大类：Computer Science 小类：Computer Networks and Communications 331 / 395 16%

发文信息

历年影响因子

历年发表

2012年	24
2013年	25
2014年	25
2015年	29
2016年	23
2017年	21
2018年	21
2019年	19
2020年	18
2021年	19
2022年	5

投稿信息

出版国家(地区)：

United States

出版商：

International Microelectronics And Packaging Society

PubMed链接：

http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1551-4897%5BISSN%5D

Journal of Microelectronics and Electronic Packaging - 最新文献

Study on the Manufacturability of X Dimension Fan Out Integration Package with Organic RDLs (XDFOI-O)

Pub Date : 2024-01-01 DOI: 10.4071/001c.115496 Haijie Chen, Ziyao Bian, Tao Liu, Jielei Xie, Jingyu Wu, Yaojian Lin, Choon Heung Lee

AlGaN High Electron Mobility Transistor for High-Temperature Logic

Pub Date : 2023-11-07 DOI: 10.4071/imaps.1832996 B. Klein, A. Allerman, A. Baca, C. Nordquist, A. Armstrong, M. V. Van Heukelom, A. Rice, V. Patel, M. Rosprim, L. Caravello, R. DeBerry, J. Pipkin, V. Abate, R. Kaplar

A Novel Approach for Characterizing Epoxy Mold Compound High Temperature Swelling

Pub Date : 2023-10-01 DOI: 10.4071/001c.91225 Ian Chin, Wei Keat Loh, Mohd Zulkifly Bin Abdullah

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