电力电子中导线键的高加速机械寿命试验

Q4 Engineering
B. Czerny, G. Khatibi
{"title":"电力电子中导线键的高加速机械寿命试验","authors":"B. Czerny, G. Khatibi","doi":"10.4071/imaps.1717134","DOIUrl":null,"url":null,"abstract":"— This article presents various experimental studies on fatigue evaluation of wire bond interconnects and interfaces in electronic devices using an accelerated mechanical fatigue testing system. This dedicated experimental setup is designed to induce fatigue failure in the weak sites of the wire bond by reproducing the thermomechanical failure modes occurring during operation. An exceptional highly test acceleration is achieved by increasing the mechanical testing frequency into the kHz regimen enabling the determination of lifetime curves in a very short time. A comparison of this method to conventional testing methods such as power cycling, a shear testing exploits the potential of customized accelerated mechanical testing. Exemplary studies on the degra- dation and fatigue failure of heavy Al wire bonds typically used in power electronics and novel Cu wire bonds are presented and advantages and some restrictions of the proposed method are discussed.","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"1 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics\",\"authors\":\"B. Czerny, G. Khatibi\",\"doi\":\"10.4071/imaps.1717134\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"— This article presents various experimental studies on fatigue evaluation of wire bond interconnects and interfaces in electronic devices using an accelerated mechanical fatigue testing system. This dedicated experimental setup is designed to induce fatigue failure in the weak sites of the wire bond by reproducing the thermomechanical failure modes occurring during operation. An exceptional highly test acceleration is achieved by increasing the mechanical testing frequency into the kHz regimen enabling the determination of lifetime curves in a very short time. A comparison of this method to conventional testing methods such as power cycling, a shear testing exploits the potential of customized accelerated mechanical testing. Exemplary studies on the degra- dation and fatigue failure of heavy Al wire bonds typically used in power electronics and novel Cu wire bonds are presented and advantages and some restrictions of the proposed method are discussed.\",\"PeriodicalId\":35312,\"journal\":{\"name\":\"Journal of Microelectronics and Electronic Packaging\",\"volume\":\"1 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Microelectronics and Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/imaps.1717134\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/imaps.1717134","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 2

摘要

-本文介绍了利用加速机械疲劳试验系统对电子设备的线键互连和接口进行疲劳评估的各种实验研究。这个专用的实验装置旨在通过重现在操作过程中发生的热机械失效模式,来诱导钢丝键合薄弱部位的疲劳失效。通过将机械测试频率提高到kHz,可以在很短的时间内确定寿命曲线,从而实现了非常高的测试加速度。将该方法与常规测试方法(如功率循环、剪切测试)进行比较,挖掘了定制加速机械测试的潜力。对电力电子中常用的重型铝丝键和新型铜丝键的退化和疲劳失效进行了实例研究,并讨论了该方法的优点和局限性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics
— This article presents various experimental studies on fatigue evaluation of wire bond interconnects and interfaces in electronic devices using an accelerated mechanical fatigue testing system. This dedicated experimental setup is designed to induce fatigue failure in the weak sites of the wire bond by reproducing the thermomechanical failure modes occurring during operation. An exceptional highly test acceleration is achieved by increasing the mechanical testing frequency into the kHz regimen enabling the determination of lifetime curves in a very short time. A comparison of this method to conventional testing methods such as power cycling, a shear testing exploits the potential of customized accelerated mechanical testing. Exemplary studies on the degra- dation and fatigue failure of heavy Al wire bonds typically used in power electronics and novel Cu wire bonds are presented and advantages and some restrictions of the proposed method are discussed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Microelectronics and Electronic Packaging
Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering
CiteScore
1.30
自引率
0.00%
发文量
5
期刊介绍: The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信