压力、烧结温度和时间对碳化硅显微组织影响的研究

IF 0.9 4区 材料科学 Q3 MATERIALS SCIENCE, CERAMICS
Z. Yaşar, V. Delucca, R. Haber
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引用次数: 0

摘要

本研究采用0.5wt的放电等离子烧结(SPS)方法对SiC陶瓷进行致密化。% B4C和1.5wt。在1900 ~ 2000℃范围内添加% C在10-50MPa的施加压力下,在1400℃下停留5-65min。考察了施加压力、烧结温度和停留时间对烧结效果的影响。在50MPa压力下烧结的试样具有高密度(>99%)和高弹性模量(~420MPa)。然而,较低的施加压力会导致密度和弹性性能的下降。1900 ~ 2000年烧结温度的升高?C在烧结时间和压力不变的情况下,导致晶粒粗化。增加1900和2000烧结试样的停留时间?C表明,在较低温度下烧结较长时间,晶粒尺寸没有明显增大。另一方面,增加2000年的居住时间?C导致了过度的晶粒生长。结果表明:放电等离子烧结温度为1900℃时可制得细晶高密度碳化硅。在50MPa下加热5min。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of the effect of pressure, sintering temperature and time on silicon carbide microstructure
In this research, SiC ceramics were densified via spark plasma sintering (SPS) with 0.5wt.% B4C and 1.5wt.% C additions at temperatures ranging from 1900 to 2000?C for 5-65min under 10-50MPa applied pressure with an intermediate dwell at 1400?C, and the effects of applied pressure, sintering temperature, and dwelling time were examined. The samples sintered under 50MPa applied pressure had high density (>99%), and showed high elastic modulus (~420MPa). However, lower applied pressure caused a decrease in density and elastic properties. The increase of sintering temperature from 1900 to 2000?C, while sintering time and pressure remained the same, caused grains coarsening. Increasing the dwelling time for the samples sintered at 1900 and 2000?C showed that sintering at a relatively lower temperature for a longer period of time did not increase grain size significantly. On the other hand, increasing the dwelling time at 2000?C caused excessive grain growth. The results show that fine-grained highly dense SiC can be produced by spark plasma sintering at 1900?C for 5min under 50MPa.
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来源期刊
Processing and Application of Ceramics
Processing and Application of Ceramics MATERIALS SCIENCE, CERAMICS-
CiteScore
1.90
自引率
9.10%
发文量
14
审稿时长
10 weeks
期刊介绍: Information not localized
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