多谐波匹配高效k波段MMIC中功率放大器设计及热可靠性分析

IF 1.3 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Active and Passive Electronic Components Pub Date : 2016-05-19 DOI:10.1155/2016/6295405

Yong-Heng Shang, Hui Xu, Jiongjiong Mo, Zhiyu Wang, Xiuqin Xu, Z. Tu, X. Zhang, H. Zheng, W. Chen, Faxin Yu

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引用次数: 4

摘要

采用砷化镓pHEMT工艺技术，设计了一种高效率k波段MMIC中功率放大器(PA)。它的工作频率以26ghz为中心，带宽为2ghz。压缩点输出功率为20dbm 1db，效率为40%。提出了一种新的基于ICEPAK的热可靠性分析方法来评价其热特性。采用QFI InfraScope™红外成像系统的测试结果与仿真结果进行了比较。在±1°C的误差范围内，它符合得很好，这反映了热分析法在准确性和使用便捷性方面的优势。

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The Design and Thermal Reliability Analysis of a High-Efficiency K-Band MMIC Medium-Power Amplifier with Multiharmonic Matching

A new high-efficiency K-band MMIC medium-power amplifier (PA) is designed with multiharmonic matching using GaAs pHEMT process technology. It has an operation frequency centered at 26 GHz with a bandwidth of 2 GHz. A 20 dBm 1 dB-compression-point output power and 40% efficiency are achieved. A novel thermal reliability analysis method based on ICEPAK is proposed also to evaluate its thermal characteristic. The test result by using a QFI InfraScope™ infrared imaging system is compared with the simulation result. It agrees well with an accuracy within ±1°C differences, which reflects the advantages of the thermal analysis method with respect to accuracy and convenience for use.

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来源期刊

Active and Passive Electronic Components ENGINEERING, ELECTRICAL & ELECTRONIC-

CiteScore

1.30

自引率

0.00%

发文量

审稿时长

13 weeks

期刊介绍： Active and Passive Electronic Components is an international journal devoted to the science and technology of all types of electronic components. The journal publishes experimental and theoretical papers on topics such as transistors, hybrid circuits, integrated circuits, MicroElectroMechanical Systems (MEMS), sensors, high frequency devices and circuits, power devices and circuits, non-volatile memory technologies such as ferroelectric and phase transition memories, and nano electronics devices and circuits.