嘉宾评论:纳米包装第二部分

IF 1.8 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Attila Bonyar;Brajesh Kumar Kaushik;James E. Morris;Markondeyaraj Pulugurtha
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引用次数: 0

摘要

在这个特殊的部分的论文集中在纳米包装。它首先回顾了三种不同的纳米技术,然后转向研究论文,主要集中在芯片上互连和降噪的纳米材料上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Guest Editorial: Nanopackaging Part II
The papers in this special section focus on nanopackaging. It begins with three reviews of diverse nanoscale technologies and then moves on to research papers focused primarily on nanomaterials for on-chip interconnect and noise abatement.
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来源期刊
CiteScore
3.90
自引率
17.60%
发文量
10
审稿时长
12 weeks
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