利用柔性多层箔技术实现各种电磁集成单元的终端配置原理

Shiqi Jiang, Panbao Wang, Wei Wang, Yitao Liu, Dianguo Xu
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引用次数: 0

摘要

柔性多层箔技术由于具有较强的集成能力,在推动无源集成技术的发展方面具有很大的潜力。了解该技术的机理对其应用和推广具有重要意义。为此,本文揭示了利用FMLF技术实现各种功能电磁集成单元的基本原理和终端配置原则。以规则FMLF绕组为研究对象,通过对其相关的分布式电磁分量(DEMC)电路的理论分析,推导出具有不同终端组态模式的集总电磁分量(LEMC)电路。并建立了FMLF绕组样机进行实验验证。通过实际测量的阻抗和基于LTspice的模拟阻抗或端口特性的比较分析,证明了LEMC电路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Terminal Configuration Principles for Achieving Various Electromagnetic Integration Units with Flexible Multilayer Foil Technique
Owing to the greater integration capability, flexible multilayer foil (FMLF) technique has a great potential to promote the evolution of passive integration techniques. To understand the mechanism of this technique is essential for its applications and popularization. To this end, this paper reveals the fundamentals and terminal configuration principles to realize various functional electromagnetic integration units with FMLF technique. A regular FMLF winding is taken as the research object, from theoretical analyses on the associated distributed electromagnetic component (DEMC) circuits, the lumped electromagnetic component (LEMC) circuits with different terminal configuration modes are derived. Moreover, A FMLF winding prototype is built for experimental verifications. The LEMC circuits are demonstrated through the comparative analyses between practically measured and LTspice based simulated impedances or port characteristics.
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