TiO2和Al2O3纳米粒子增强Sn-3.0Ag-0.5Cu焊料在不同回流时间下的润湿性。

IF 4.4 3区 材料科学 Q2 CHEMISTRY, MULTIDISCIPLINARY
Nanomaterials Pub Date : 2023-10-23 DOI:10.3390/nano13202811
Nur Haslinda Mohamed Muzni, Ervina Efzan Mhd Noor, Mohd Mustafa Al Bakri Abdullah
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引用次数: 0

摘要

本研究研究了增强0.50wt.%的氧化钛(TiO2)和氧化铝(Al2O3)纳米颗粒对Sn-3.0Ag-0.5Cu(SAC305)焊料合金润湿性能的影响。SAC305纳米复合材料焊料的热性能与峰值温度窗口在240至250°C范围内的SAC305焊料相当。利用接触角和扩展面积测定和测量了非增强和增强SAC305纳米复合焊料的润湿行为,并研究了它们之间的关系。当用0.50wt.%的TiO2和Al2O3纳米颗粒增强SAC305焊料时,随着回流时间增加至60s,扩展面积(5.6至7.32mm)增加了30.71%,接触角(26.3至18.6°)减少了14.29%。与SAC305焊料相比,SAC305纳米复合焊料具有更好的润湿性能。随着回流时间的增加,扩展面积增加,接触角减小,这限制了金属间化合物的生长,从而提高了润湿性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times.

Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times.

Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO<sub>2</sub> and Al<sub>2</sub>O<sub>3</sub> Nanoparticles at Different Reflow Times.

Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO2 and Al2O3 Nanoparticles at Different Reflow Times.

This study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO2) and aluminium oxide (Al2O3) nanoparticles on the wettability performance of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of the SAC305 nanocomposite solder are comparable with thos of an SAC305 solder with a peak temperature window within a range of 240 to 250 °C. The wetting behaviour of the non-reinforced and reinforced SAC305 nanocomposite solder was determined and measured using the contact angle and spreading area and the relationships between them were studied. There is an increment in the spreading area (5.6 to 7.32 mm) by 30.71% and a reduction in the contact angle (26.3 to 18.6°) by 14.29% with an increasing reflow time up to 60 s when reinforcing SAC305 solder with 0.50 wt.% of TiO2 and Al2O3 nanoparticles. The SAC305 nanocomposite solder has a better wetting performance compared with the SAC305 solder. As the reflow time increased, the spreading area increased and the contact angle decreased, which restricted intermetallic compound growth and thus improved wettability performance.

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来源期刊
Nanomaterials
Nanomaterials NANOSCIENCE & NANOTECHNOLOGY-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
8.50
自引率
9.40%
发文量
3841
审稿时长
14.22 days
期刊介绍: Nanomaterials (ISSN 2076-4991) is an international and interdisciplinary scholarly open access journal. It publishes reviews, regular research papers, communications, and short notes that are relevant to any field of study that involves nanomaterials, with respect to their science and application. Thus, theoretical and experimental articles will be accepted, along with articles that deal with the synthesis and use of nanomaterials. Articles that synthesize information from multiple fields, and which place discoveries within a broader context, will be preferred. There is no restriction on the length of the papers. Our aim is to encourage scientists to publish their experimental and theoretical research in as much detail as possible. Full experimental or methodical details, or both, must be provided for research articles. Computed data or files regarding the full details of the experimental procedure, if unable to be published in a normal way, can be deposited as supplementary material. Nanomaterials is dedicated to a high scientific standard. All manuscripts undergo a rigorous reviewing process and decisions are based on the recommendations of independent reviewers.
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