钛络合物制备TiO2薄膜的MOCVD研究:前驱体评价及光学、光电化学和电学性能研究

Manish Banerjee, Van-Son Dang, Michal Bledowski, Radim Beranek, Hans-Werner Becker, Detlef Rogalla, Eugen Edengeiser, Martina Havenith, Andreas D. Wieck, Anjana Devi
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引用次数: 4

摘要

以四基-二甲氨基钛(IV) [Ti(NMe2)4]为原料,通过简单消去反应合成了一种具有混合氧/氮配位球[Ti(dmap)2(NMe2)2] (Hdmap = 1 -二甲氨基- 2 -丙醇)的新型异亲钛前驱体。与母体烷基酰胺[Ti(NMe2)4]相比,该化合物在化学和热稳定性方面表现出令人鼓舞的结果,因此更适合MOCVD应用。在500-800℃的温度范围内,通过MOCVD在Si(100)和ito涂层的硼硅酸盐玻璃衬底上生长TiO2薄膜。沉积温度对所得到的TiO2薄膜的物相和微观结构有显著影响,从而影响其功能性能。薄膜的光学带隙在2.92 ~ 3.36 eV之间。在700°C条件下生长的膜在水溶液中具有最佳的光电流响应(在AM 1.5 g条件下为1.5 mA cm−2),具有更好的结晶度和多孔柱状结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

MOCVD of TiO2 Thin Films using a Heteroleptic Titanium Complex: Precursor Evaluation and Investigation of Optical, Photoelectrochemical and Electrical Properties†

MOCVD of TiO2 Thin Films using a Heteroleptic Titanium Complex: Precursor Evaluation and Investigation of Optical, Photoelectrochemical and Electrical Properties†

A new heteroleptic titanium precursor with a mixed oxygen/nitrogen coordination sphere [Ti(dmap)2(NMe2)2] (Hdmap = 1–dimethylamino–2–propanol) is synthesized by a simple elimination reaction on tetrakis–dimethylaminotitanium(IV) [Ti(NMe2)4]. The compound shows encouraging results in terms of chemical and thermal stability compared to the parent alkyl amide [Ti(NMe2)4], and is therefore more suitable for MOCVD applications. TiO2 thin films are grown on Si(100) and ITO-coated borosilicate glass substrates via MOCVD in the temperature range 500–800°C. The deposition temperature has a significant effect on the phase and microstructure of the TiO2 films obtained, which influences the functional properties. The optical bandgaps of the films are in the range 2.92–3.36 eV. The best photocurrent response (1.5 mA cm−2 under AM 1.5G conditions) in aqueous electrolytes is observed for films grown at 700°C having improved crystallinity and porous columnar structure.

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来源期刊
Chemical Vapor Deposition
Chemical Vapor Deposition 工程技术-材料科学:膜
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>12 weeks
期刊介绍: Chemical Vapor Deposition (CVD) publishes Reviews, Short Communications, and Full Papers on all aspects of chemical vapor deposition and related technologies, along with other articles presenting opinion, news, conference information, and book reviews. All papers are peer-reviewed. The journal provides a unified forum for chemists, physicists, and engineers whose publications on chemical vapor deposition have in the past been spread over journals covering inorganic chemistry, materials chemistry, organometallics, applied physics and semiconductor technology, thin films, and ceramic processing.
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