利用EBSD和TEM分析8 μm电解铜箔的平面微观结构

Q3 Immunology and Microbiology

Applied Microscopy Pub Date : 2022-03-28 DOI:10.1186/s42649-022-00071-4

Myeongjin Kim, Hyun Soon Park

{"title":"利用EBSD和TEM分析8 μm电解铜箔的平面微观结构","authors":"Myeongjin Kim, Hyun Soon Park","doi":"10.1186/s42649-022-00071-4","DOIUrl":null,"url":null,"abstract":"<div><p>With the lightening of the mobile devices, thinning of electrolytic copper foil, which is mainly used as an anode collection of lithium secondary batteries, is needed. As the copper foil becomes ultrathin, mechanical properties such as deterioration of elongation rate and tear phenomenon are occurring, which is closely related to microstructure. However, there is a problem that it is not easy to prepare and observe specimens in the analysis of the microstructure of ultrathin copper foil. In this study, electron backscatter diffraction (EBSD) specimens were fabricated using only mechanical polishing to analyze the microstructure of 8 μm thick electrolytic copper foil in plane view. In addition, EBSD maps and transmission electron microscopy (TEM) images were compared and analyzed to find the optimal cleanup technique for properly correcting errors in EBSD maps.</p></div>","PeriodicalId":470,"journal":{"name":"Applied Microscopy","volume":"52 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2022-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://appmicro.springeropen.com/counter/pdf/10.1186/s42649-022-00071-4","citationCount":"1","resultStr":"{\"title\":\"Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM\",\"authors\":\"Myeongjin Kim, Hyun Soon Park\",\"doi\":\"10.1186/s42649-022-00071-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>With the lightening of the mobile devices, thinning of electrolytic copper foil, which is mainly used as an anode collection of lithium secondary batteries, is needed. As the copper foil becomes ultrathin, mechanical properties such as deterioration of elongation rate and tear phenomenon are occurring, which is closely related to microstructure. However, there is a problem that it is not easy to prepare and observe specimens in the analysis of the microstructure of ultrathin copper foil. In this study, electron backscatter diffraction (EBSD) specimens were fabricated using only mechanical polishing to analyze the microstructure of 8 μm thick electrolytic copper foil in plane view. In addition, EBSD maps and transmission electron microscopy (TEM) images were compared and analyzed to find the optimal cleanup technique for properly correcting errors in EBSD maps.</p></div>\",\"PeriodicalId\":470,\"journal\":{\"name\":\"Applied Microscopy\",\"volume\":\"52 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-03-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://appmicro.springeropen.com/counter/pdf/10.1186/s42649-022-00071-4\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applied Microscopy\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://link.springer.com/article/10.1186/s42649-022-00071-4\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"Immunology and Microbiology\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Microscopy","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1186/s42649-022-00071-4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Immunology and Microbiology","Score":null,"Total":0}

引用次数: 1

摘要

随着移动设备的轻量化，需要对主要用作锂二次电池阳极收集的电解铜箔进行减薄处理。随着铜箔的超薄化，会出现伸长率变差、撕裂等力学性能，这与微观组织密切相关。但是，在超薄铜箔的微观结构分析中，存在不易制备和观察试样的问题。采用机械抛光法制备电子背散射衍射(EBSD)试样，对8 μm厚电解铜箔的平面微观结构进行了分析。此外，还比较分析了EBSD图和透射电子显微镜(TEM)图像，以寻找最佳的清除技术来正确纠正EBSD图中的错误。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM

With the lightening of the mobile devices, thinning of electrolytic copper foil, which is mainly used as an anode collection of lithium secondary batteries, is needed. As the copper foil becomes ultrathin, mechanical properties such as deterioration of elongation rate and tear phenomenon are occurring, which is closely related to microstructure. However, there is a problem that it is not easy to prepare and observe specimens in the analysis of the microstructure of ultrathin copper foil. In this study, electron backscatter diffraction (EBSD) specimens were fabricated using only mechanical polishing to analyze the microstructure of 8 μm thick electrolytic copper foil in plane view. In addition, EBSD maps and transmission electron microscopy (TEM) images were compared and analyzed to find the optimal cleanup technique for properly correcting errors in EBSD maps.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Applied Microscopy Immunology and Microbiology-Applied Microbiology and Biotechnology

CiteScore

3.40

自引率

0.00%

发文量

审稿时长

10 weeks

期刊介绍： Applied Microscopy is a peer-reviewed journal sponsored by the Korean Society of Microscopy. The journal covers all the interdisciplinary fields of technological developments in new microscopy methods and instrumentation and their applications to biological or materials science for determining structure and chemistry. ISSN: 22875123, 22874445.