{"title":"三门动态闪存(3G_DFM)设计对长空穴保持时间和鲁棒干扰屏蔽的影响","authors":"Koji Sakui, Yisuo Li, Masakazu Kakumu, Kenichi Kanazawa, Iwao Kunishima, Yoshihisa Iwata, Nozomu Harada","doi":"10.1016/j.memori.2023.100054","DOIUrl":null,"url":null,"abstract":"<div><p>TCAD simulation using Silvaco software has shown that the 3G_DFM, which has <em>SG1</em> (Select Gate 1), <em>PL</em> (Plate Line Gate), and <em>SG2</em> (Select Gate 2) between <em>SL</em> (Source Line) and <em>BL</em> (Bit Line), has a long retention time of 100ms at 85 °C, and a robust disturbance shield which is a thousand times <em>BL</em> stress. The two select gates <em>SG1</em> and <em>SG2</em> protect the recombination of holes in the <em>FB</em> (Floating Body) at the <em>SL</em> and <em>BL</em> pn-junctions, and shield the <em>BL</em> stress arising during other page operations, which leads to the <em>GIDL (Gate Induced Drain Leakage)</em> current.</p></div>","PeriodicalId":100915,"journal":{"name":"Memories - Materials, Devices, Circuits and Systems","volume":"4 ","pages":"Article 100054"},"PeriodicalIF":0.0000,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design impact on three gate Dynamic Flash Memory (3G_DFM) for long hole retention time and robust disturbance shield\",\"authors\":\"Koji Sakui, Yisuo Li, Masakazu Kakumu, Kenichi Kanazawa, Iwao Kunishima, Yoshihisa Iwata, Nozomu Harada\",\"doi\":\"10.1016/j.memori.2023.100054\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>TCAD simulation using Silvaco software has shown that the 3G_DFM, which has <em>SG1</em> (Select Gate 1), <em>PL</em> (Plate Line Gate), and <em>SG2</em> (Select Gate 2) between <em>SL</em> (Source Line) and <em>BL</em> (Bit Line), has a long retention time of 100ms at 85 °C, and a robust disturbance shield which is a thousand times <em>BL</em> stress. The two select gates <em>SG1</em> and <em>SG2</em> protect the recombination of holes in the <em>FB</em> (Floating Body) at the <em>SL</em> and <em>BL</em> pn-junctions, and shield the <em>BL</em> stress arising during other page operations, which leads to the <em>GIDL (Gate Induced Drain Leakage)</em> current.</p></div>\",\"PeriodicalId\":100915,\"journal\":{\"name\":\"Memories - Materials, Devices, Circuits and Systems\",\"volume\":\"4 \",\"pages\":\"Article 100054\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Memories - Materials, Devices, Circuits and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2773064623000312\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Memories - Materials, Devices, Circuits and Systems","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2773064623000312","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design impact on three gate Dynamic Flash Memory (3G_DFM) for long hole retention time and robust disturbance shield
TCAD simulation using Silvaco software has shown that the 3G_DFM, which has SG1 (Select Gate 1), PL (Plate Line Gate), and SG2 (Select Gate 2) between SL (Source Line) and BL (Bit Line), has a long retention time of 100ms at 85 °C, and a robust disturbance shield which is a thousand times BL stress. The two select gates SG1 and SG2 protect the recombination of holes in the FB (Floating Body) at the SL and BL pn-junctions, and shield the BL stress arising during other page operations, which leads to the GIDL (Gate Induced Drain Leakage) current.