GaN HEMT的大信号建模:过去、发展和未来

Chip Pub Date : 2023-09-01 DOI:10.1016/j.chip.2023.100052
Haorui Luo , Wenrui Hu , Yongxin Guo
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引用次数: 1

摘要

在过去的几十年里,基于氮化镓高电子迁移率晶体管(GaN-HEMT)的电路在大功率和高频应用中表现出了非凡的潜力,如新一代移动通信、物体检测和消费电子等,GaN-HEMT大信号模型在GaN-HEET器件和电路的设计、应用和开发中起着关键作用。这篇综述对近几十年来GaN HEMT大信号建模的进展进行了深入的研究。详细全面地介绍了GaN-HEMT大信号模型的各个方面,包括大信号测量装置、经典公式化方法、模型分类和非理想效应等。为了更好地为后续研究服务,本文还探讨了GaN-HEMT大信号建模的潜在发展方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On large-signal modeling of GaN HEMTs: past, development and future

In the past few decades, circuits based on gallium nitride high electron mobility transistor (GaN HEMT) have demonstrated exceptional potential in a wide range of high-power and high-frequency applications, such as the new generation mobile communications, object detection and consumer electronics, etc. As a critical intermediary between GaN HEMT devices and circuit-level applications, GaN HEMT large-signal models play a pivotal role in the design, application and development of GaN HEMT devices and circuits. This review provides an in-depth examination of the advancements in GaN HEMT large-signal modeling in recent decades. Detailed and comprehensive coverage of various aspects of GaN HEMT large-signal model was offered, including large-signal measurement setups, classical formulation methods, model classification and non-ideal effects, etc. In order to better serve follow-up researches, this review also explored potential future directions for the development of GaN HEMT large-signal modeling.

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