用于5G毫米波移动应用的封装上最小形状因数的多层陶瓷贴片天线

IF 2.5 3区物理与天体物理 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Photonics and Nanostructures-Fundamentals and Applications Pub Date : 2023-09-30 DOI:10.1016/j.photonics.2023.101189

Sung Yong An, Boumseock Kim

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引用次数: 0

摘要

本文提出了一种新的5G毫米波阵列天线设计方案，该天线宽度仅为2.8毫米，采用多层高温陶瓷衬底。该天线旨在满足美观、符合人体工程学的智能手机设计和高效组件安装的要求。为了克服陶瓷衬底的高相对介电常数和介电损耗正切带来的挑战，作者使用了具有空气腔和U形探针馈电结构的聚合物粘合层。由此产生的1×5陶瓷阵列天线在24.25–28.35 GHz的低频段和37–40 GHz的高频段具有−10 dB的阻抗带宽，覆盖了5G新无线电频率范围n258、n260和n261。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Smallest form-factor multi-stacked ceramic patch antenna on package for 5G millimeter-wave mobile applications

A new design for a 5G millimeter-wave array antenna that is only 2.8 mm wide, using multi-stacked high-temperature ceramic substrates, is proposed in this paper. The antenna is designed to meet the requirements for esthetically pleasing and ergonomic smartphone designs and efficient component installations. To overcome challenges posed by the high relative permittivity and dielectric loss tangent of the ceramic substrates, the authors use a polymer adhesion layer with an air cavity and U-shaped probe feeding structures. The resulting 1 × 5 ceramic array antenna has a −10 dB impedance bandwidth in the low-band range of 24.25–28.35 GHz and the high-band range of 37–40 GHz, which covers the 5G New Radio frequency ranges n258, n260, and n261.

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来源期刊

Photonics and Nanostructures-Fundamentals and Applications 工程技术-材料科学：综合

CiteScore

5.00

自引率

3.70%

发文量

审稿时长

62 days

期刊介绍： This journal establishes a dedicated channel for physicists, material scientists, chemists, engineers and computer scientists who are interested in photonics and nanostructures, and especially in research related to photonic crystals, photonic band gaps and metamaterials. The Journal sheds light on the latest developments in this growing field of science that will see the emergence of faster telecommunications and ultimately computers that use light instead of electrons to connect components.