可靠地加强球栅阵列，同时最大限度地减少焊点应力

{"title":"可靠地加强球栅阵列，同时最大限度地减少焊点应力","authors":"Markus Schindler","doi":"10.1007/s35784-023-0919-8","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":100026,"journal":{"name":"adhesion ADHESIVES + SEALANTS","volume":"20 2","pages":"12 - 17"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://link.springer.com/content/pdf/10.1007/s35784-023-0919-8.pdf","citationCount":"0","resultStr":"{\"title\":\"Reliably Reinforcing Ball Grid Arrays While Minimizing Stress on Solder Joints\",\"authors\":\"Markus Schindler\",\"doi\":\"10.1007/s35784-023-0919-8\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":100026,\"journal\":{\"name\":\"adhesion ADHESIVES + SEALANTS\",\"volume\":\"20 2\",\"pages\":\"12 - 17\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-05-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://link.springer.com/content/pdf/10.1007/s35784-023-0919-8.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"adhesion ADHESIVES + SEALANTS\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s35784-023-0919-8\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"adhesion ADHESIVES + SEALANTS","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1007/s35784-023-0919-8","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}