{"title":"同步降压DC-DC变换器的多尺度电磁兼容建模、仿真和验证","authors":"Rajen Murugan;Jie Chen;Ambreesh Tripathi;Bibhu Prasad Nayak;Harikiran Muniganti;Dipanjan Gope","doi":"10.1109/JMMCT.2023.3276358","DOIUrl":null,"url":null,"abstract":"The proliferation of power electronics in automotive and industrial applications raises compliance challenges in meeting electromagnetic compatibility (EMC) regulatory standards. In this work, we develop a robust multiscale system-level modeling and simulation methodology for predicting CISPR 25 conducted emission (CE) and radiated emission (RE). The method is based on a novel two-stage process. In the first stage, the IC model is generated either by non-linear time-domain simulation using a device-level physics model or oscilloscope measurements if a prototype is available. In the second stage, the IC model waveforms are used in a simulation environment comprising 3D full-wave frequency domain analysis and specially prepared macro-models for the laboratory equipment. Silicon validation of CISPR 25 EMC measurements on a “low-EMI,” high-performance DCDC automotive/industrial synchronous step-down converter is presented to validate the integrity of the predictive modeling methodology. Good correlations between modeling and EMC-certified testing laboratory emission measurements are achieved (i.e., within +/- 3 dBuV for CE and +/- 6 dBuV for RE). As a result, the predictive EMC modeling methodology can be implemented, early in the design cycle, to ensure first-pass EMC-compliant design.","PeriodicalId":52176,"journal":{"name":"IEEE Journal on Multiscale and Multiphysics Computational Techniques","volume":"8 ","pages":"269-280"},"PeriodicalIF":1.8000,"publicationDate":"2023-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Multiscale EMC Modeling, Simulation, and Validation of a Synchronous Step-Down DC-DC Converter\",\"authors\":\"Rajen Murugan;Jie Chen;Ambreesh Tripathi;Bibhu Prasad Nayak;Harikiran Muniganti;Dipanjan Gope\",\"doi\":\"10.1109/JMMCT.2023.3276358\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The proliferation of power electronics in automotive and industrial applications raises compliance challenges in meeting electromagnetic compatibility (EMC) regulatory standards. In this work, we develop a robust multiscale system-level modeling and simulation methodology for predicting CISPR 25 conducted emission (CE) and radiated emission (RE). The method is based on a novel two-stage process. In the first stage, the IC model is generated either by non-linear time-domain simulation using a device-level physics model or oscilloscope measurements if a prototype is available. In the second stage, the IC model waveforms are used in a simulation environment comprising 3D full-wave frequency domain analysis and specially prepared macro-models for the laboratory equipment. Silicon validation of CISPR 25 EMC measurements on a “low-EMI,” high-performance DCDC automotive/industrial synchronous step-down converter is presented to validate the integrity of the predictive modeling methodology. Good correlations between modeling and EMC-certified testing laboratory emission measurements are achieved (i.e., within +/- 3 dBuV for CE and +/- 6 dBuV for RE). As a result, the predictive EMC modeling methodology can be implemented, early in the design cycle, to ensure first-pass EMC-compliant design.\",\"PeriodicalId\":52176,\"journal\":{\"name\":\"IEEE Journal on Multiscale and Multiphysics Computational Techniques\",\"volume\":\"8 \",\"pages\":\"269-280\"},\"PeriodicalIF\":1.8000,\"publicationDate\":\"2023-06-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Journal on Multiscale and Multiphysics Computational Techniques\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10144433/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal on Multiscale and Multiphysics Computational Techniques","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10144433/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Multiscale EMC Modeling, Simulation, and Validation of a Synchronous Step-Down DC-DC Converter
The proliferation of power electronics in automotive and industrial applications raises compliance challenges in meeting electromagnetic compatibility (EMC) regulatory standards. In this work, we develop a robust multiscale system-level modeling and simulation methodology for predicting CISPR 25 conducted emission (CE) and radiated emission (RE). The method is based on a novel two-stage process. In the first stage, the IC model is generated either by non-linear time-domain simulation using a device-level physics model or oscilloscope measurements if a prototype is available. In the second stage, the IC model waveforms are used in a simulation environment comprising 3D full-wave frequency domain analysis and specially prepared macro-models for the laboratory equipment. Silicon validation of CISPR 25 EMC measurements on a “low-EMI,” high-performance DCDC automotive/industrial synchronous step-down converter is presented to validate the integrity of the predictive modeling methodology. Good correlations between modeling and EMC-certified testing laboratory emission measurements are achieved (i.e., within +/- 3 dBuV for CE and +/- 6 dBuV for RE). As a result, the predictive EMC modeling methodology can be implemented, early in the design cycle, to ensure first-pass EMC-compliant design.