基于三维微孔PDMS/MWCNTs的宽压力范围柔性压力传感器,用于人体运动检测

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Chun-Sheng Jiang, Ru-Yue Lv, Yan-Li Zou, Hui-Ling Peng
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引用次数: 0

摘要

在柔性压力传感器中引入微结构是提高传感器性能的有效策略。在此,我们基于聚二甲基硅氧烷(PDMS)和多壁碳纳米管(MWCNTs)的杂化物,制备了一种具有三维(3D)微孔的柔性压力传感器。使用NH4HCO3作为牺牲模板,通过简单且低成本的工艺制备了3D微孔,NH4HCO3颗粒被分解为气体,并在PDMS和MWCNTs的混合物中留下微孔。传感器内部的微孔结构允许宽的压力范围(~140 kPa)。该传感器可以检测手指、手腕、肘部、膝盖的大动作,甚至面部表情等小动作。此外,还成功地将3×3触觉传感器阵列应用于抓握杯子的手指压力分布。结果表明,该传感器在可穿戴电子设备和压力传感人机界面中具有很好的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Flexible pressure sensor with wide pressure range based on 3D microporous PDMS/MWCNTs for human motion detection

Flexible pressure sensor with wide pressure range based on 3D microporous PDMS/MWCNTs for human motion detection

Introducing microstructure in the flexible pressure sensors is an effective strategy to enhance the performance of the sensor. Herein, we fabricated a flexible pressure sensor with three-dimensional (3D) miroporous based on a hybrid of polydimethylsiloxane (PDMS) and multiwalled carbon nanotubes (MWCNTs). The 3D microporous was produced by a facile and low-cost process using NH4HCO3 as a sacrificial template, the NH4HCO3 particles were decomposed to gas and left microporous in the hybrid of PDMS and MWCNTs. The microporous structure inside the sensor allowed for a wide pressure range (∼140 kPa). The sensor could detect large motions of finger, wrist, elbow, knee, and even small motion such as facial expression. In addition, a 3 × 3 tactile sensor array was successfully applied in the pressure distribution of fingers to grasp a cup. The results demonstrate that the sensor is promising application in wearable electronics and human-machine interfaces for pressure sensing.

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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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