Xin Xu , Pan Xue , Meng Gao , Yibin Li , Zijun Xu , Yu Wei , Zhengjian Zhang , Yang Liu , Lei Wang , Hongbin Liu , Bowen Cheng
{"title":"通过印刷和涂层组装用于柔性电子设备的一维纳米线:技术、应用和前景。","authors":"Xin Xu , Pan Xue , Meng Gao , Yibin Li , Zijun Xu , Yu Wei , Zhengjian Zhang , Yang Liu , Lei Wang , Hongbin Liu , Bowen Cheng","doi":"10.1016/j.cis.2023.102987","DOIUrl":null,"url":null,"abstract":"<div><p><span><span><span>The rapid progress in flexible electronic devices has necessitated continual research into nanomaterials, structural design, and fabrication processes. One-dimensional </span>nanowires, characterized by their distinct structures and exceptional properties, are considered essential components for various flexible electronic devices. Considerable attention has been directed toward the assembly of nanowires, which presents significant advantages. Printing and </span>coating techniques can be used to assemble nanowires in a relatively simple, efficient, and cost-competitive manner and exhibit potential for scale-up production in the foreseeable future. This review aims to provide an overview of nanowire assembly using printing and coating techniques, such as bar coating, </span>spray<span> coating, dip coating, blade coating, 3D printing, and so forth. The application of assembled nanowires in flexible electronic devices is subsequently discussed. Finally, further discussion is presented on the potential and challenges of flexible electronic devices based on assembled nanowires via printing and coating.</span></p></div>","PeriodicalId":239,"journal":{"name":"Advances in Colloid and Interface Science","volume":"321 ","pages":"Article 102987"},"PeriodicalIF":15.9000,"publicationDate":"2023-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Assembled one-dimensional nanowires for flexible electronic devices via printing and coating: Techniques, applications, and perspectives\",\"authors\":\"Xin Xu , Pan Xue , Meng Gao , Yibin Li , Zijun Xu , Yu Wei , Zhengjian Zhang , Yang Liu , Lei Wang , Hongbin Liu , Bowen Cheng\",\"doi\":\"10.1016/j.cis.2023.102987\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p><span><span><span>The rapid progress in flexible electronic devices has necessitated continual research into nanomaterials, structural design, and fabrication processes. One-dimensional </span>nanowires, characterized by their distinct structures and exceptional properties, are considered essential components for various flexible electronic devices. Considerable attention has been directed toward the assembly of nanowires, which presents significant advantages. Printing and </span>coating techniques can be used to assemble nanowires in a relatively simple, efficient, and cost-competitive manner and exhibit potential for scale-up production in the foreseeable future. This review aims to provide an overview of nanowire assembly using printing and coating techniques, such as bar coating, </span>spray<span> coating, dip coating, blade coating, 3D printing, and so forth. The application of assembled nanowires in flexible electronic devices is subsequently discussed. Finally, further discussion is presented on the potential and challenges of flexible electronic devices based on assembled nanowires via printing and coating.</span></p></div>\",\"PeriodicalId\":239,\"journal\":{\"name\":\"Advances in Colloid and Interface Science\",\"volume\":\"321 \",\"pages\":\"Article 102987\"},\"PeriodicalIF\":15.9000,\"publicationDate\":\"2023-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advances in Colloid and Interface Science\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0001868623001549\",\"RegionNum\":1,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advances in Colloid and Interface Science","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0001868623001549","RegionNum":1,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
Assembled one-dimensional nanowires for flexible electronic devices via printing and coating: Techniques, applications, and perspectives
The rapid progress in flexible electronic devices has necessitated continual research into nanomaterials, structural design, and fabrication processes. One-dimensional nanowires, characterized by their distinct structures and exceptional properties, are considered essential components for various flexible electronic devices. Considerable attention has been directed toward the assembly of nanowires, which presents significant advantages. Printing and coating techniques can be used to assemble nanowires in a relatively simple, efficient, and cost-competitive manner and exhibit potential for scale-up production in the foreseeable future. This review aims to provide an overview of nanowire assembly using printing and coating techniques, such as bar coating, spray coating, dip coating, blade coating, 3D printing, and so forth. The application of assembled nanowires in flexible electronic devices is subsequently discussed. Finally, further discussion is presented on the potential and challenges of flexible electronic devices based on assembled nanowires via printing and coating.
期刊介绍:
"Advances in Colloid and Interface Science" is an international journal that focuses on experimental and theoretical developments in interfacial and colloidal phenomena. The journal covers a wide range of disciplines including biology, chemistry, physics, and technology.
The journal accepts review articles on any topic within the scope of colloid and interface science. These articles should provide an in-depth analysis of the subject matter, offering a critical review of the current state of the field. The author's informed opinion on the topic should also be included. The manuscript should compare and contrast ideas found in the reviewed literature and address the limitations of these ideas.
Typically, the articles published in this journal are written by recognized experts in the field.