剪切减薄流体电渗流蠕动泵送的热力学评价

IF 1 Q4 ENGINEERING, MANUFACTURING
S. Noreen, M. Zahra
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引用次数: 0

摘要

基于电路的芯片实验室系统的设计和操作需要由热电动力推动的流体。芯片上的操作,包括沿着微通道产生热量和控制液体流动,在传统意义上都是相关的。本文利用电渗(EOF)蠕动泵演示了热对假塑性流体流动的影响。控制微通道应用的基本热传输方程是从理论考虑发展起来的。当考虑长波长和低雷诺数时,给出了压力梯度、流函数、传热系数和温度分布的显式方程。解析解采用正则摄动方法。然后,使用Mathematica软件对所得方程进行求解。物理量使用各种参数进行分析。每个参数的结果在最后都可以直观地显示出来。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermodynamic Evaluation of Electroosmotic Peristaltic Pumping for Shear-Thinning Fluid Flow
The design and operation of lab-on-a-chip systems that are based on electrical circuits require fluids that are propelled by thermo-electrokinetic forces. On-chip operations including the generation of heat along microchannels and the control of liquid flow are all relevant in the traditional sense. The influence of heat on pseudoplastic fluid flow is demonstrated in this work using electroosmotic (EOF) peristaltic pumping. The fundamental heat-transport equations that govern microchannel applications are developed from theoretical considerations. Explicit equations are presented for pressure gradient, stream functions, heat transfer coefficient, and temperature distribution when long wave length and low Reynolds numbers are taken into account. Analytical solutions employ a regular perturbation approach. Then, Mathematica software is used to solve the resulting equation. Physical quantities are analysed using a variety of parameters. The results are visibly presented for each parameter at the end.
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来源期刊
Journal of Micro and Nano-Manufacturing
Journal of Micro and Nano-Manufacturing ENGINEERING, MANUFACTURING-
CiteScore
2.70
自引率
0.00%
发文量
12
期刊介绍: The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.
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