无源元件的垂直嵌入对PCB小型化的贡献

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Packaging Pub Date : 2023-05-05 DOI:10.1115/1.4062470

Peter Lukacs, Tibor Rovensky, A. Otáhal

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引用次数: 0

摘要

本研究描述了一种将无源SMD元件嵌入印刷电路板的新颖且非传统的方法。因此，封装尺寸为0201的无源元件被嵌入两种类型的过孔中。研究和描述了各种工艺因素对嵌入式无源元件最终质量的影响，包括锡铅和无铅焊膏、各种类型和尺寸的过孔、各种焊接技术以及回流过程中的样品位置。结果表明，锡铅焊膏和聚合物焊膏对无源元件嵌入过程中产生电短路的影响。用于嵌入无源元件的微孔的应用消除了基本问题，如电短路、元件错位和创建可靠焊点的低成功率。实验结果验证了所提出的通过在微孔中嵌入无源元件来实现印刷电路板小型化的方法。所提出的方法的可靠性得到了电气测量的进一步支持。本研究描述了一种适用于PCB原型设计的方法，该方法对硬件设计和电子技术的贡献微乎其微。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A Contribution to PCBs' Miniaturization by the Vertical Embedding of Passive Components

This study describes a novel and unconventional approach for embedding passive SMD components into printed circuit boards. Therefore, passive components whose package size is 0201 are embedded in two types of vias. On the final quality of an embedded passive component, the effects of various technological factors, including tin-lead and lead-free solder pastes, various types and dimensions of vias, various soldering techniques, and sample positions during the reflow process, have been investigated and described. The results show the impact of tin-lead solder paste and polymeric solder paste on the creation of electrical shorts in the embedding of passive components. The application of microvias for the embedding of passive components eliminates the fundamental issues, such as electrical shorts, component dislocation, and the low success rate for creating a reliable solder joint. The proposed method for miniaturizing printed circuit boards by embedding passive components in microvias was verified by experimental results. The reliability of the proposed methodology is further supported by electrical measurements. This study describes an approach suitable to PCB prototyping that makes a negligible contribution to hardware design and electronic technologies.

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来源期刊

Journal of Electronic Packaging 工程技术-工程：电子与电气

CiteScore

4.90

自引率

6.20%

发文量

审稿时长

3 months

期刊介绍： The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.