用光束偏转法测量和控制电磁驱动悬臂

IF 1.1 4区 工程技术 Q4 INSTRUMENTS & INSTRUMENTATION
D. Kopiec, W. Majstrzyk, B. Pruchnik, Ewelina Gacka, Dominik Badura, A. Sierakowski, P. Janus, T. Gotszalk
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引用次数: 1

摘要

本文介绍了电磁驱动微悬臂梁的测量与控制方法和技术。电磁驱动悬臂梁属于微机电系统(MEMS),可用于高分辨率力和质量变化的研究。在描述的实验中,研究了集成洛伦兹电流环的硅悬臂梁。采用改进的光束偏转(OBD)系统对电磁驱动悬臂梁进行了表征,该系统的结构进行了优化,以提高其分辨率。OBD系统的灵敏度采用参考悬臂梁进行校准,参考悬臂梁的弹簧常数通过记录干涉的热机械噪声分析确定。利用优化标定后的OBD系统对电磁偏转悬臂梁的共振和双向静挠度进行了观测。经过理论分析和进一步的实验,可以获得5.28 mV/nm的设置灵敏度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Metrology and control of electromagnetically actuated cantilevers using optical beam deflection method
In this paper, we present metrology and control methods and techniques for electromagnetically actuated microcantilevers. The electromagnetically actuated cantilevers belong to the micro electro mechanical systems (MEMS), which can be used in high resolution force and mass change investigations. In the described experiments, silicon cantilevers with an integrated Lorentz current loop were investigated. The electromag-netically actuated cantilevers were characterized using a modified optical beam deflection (OBD) system, whose architecture was optimized in order to increase its resolution. The sensitivity of the OBD system was calibrated using a reference cantilever, whose spring constant was determined through thermomechanical noise analysis registered interferometrically. The optimized and calibrated OBD system was used to observe the resonance and bidirectional static deflection of the electromagnetically deflected cantilevers. After theoretical analysis and further experiments, it was possible to obtain setup sensitivity equal to 5.28 mV/nm.
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来源期刊
Metrology and Measurement Systems
Metrology and Measurement Systems INSTRUMENTS & INSTRUMENTATION-
CiteScore
2.00
自引率
10.00%
发文量
0
审稿时长
6 months
期刊介绍: Contributions are invited on all aspects of the research, development and applications of the measurement science and technology. The list of topics covered includes: theory and general principles of measurement; measurement of physical, chemical and biological quantities; medical measurements; sensors and transducers; measurement data acquisition; measurement signal transmission; processing and data analysis; measurement systems and embedded systems; design, manufacture and evaluation of instruments. The average publication cycle is 6 months.
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