通过沉积用于柔性电子器件的液态金属颗粒实现高导电性激光诱导石墨烯

IF 2.8 4区 工程技术 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Halil Tetik, Emmy Markgraf, Kohya Kato, Valerie N Chan, M. Malakooti
{"title":"通过沉积用于柔性电子器件的液态金属颗粒实现高导电性激光诱导石墨烯","authors":"Halil Tetik, Emmy Markgraf, Kohya Kato, Valerie N Chan, M. Malakooti","doi":"10.1088/2058-8585/ace26b","DOIUrl":null,"url":null,"abstract":"The rapid and simple fabrication process of laser-induced graphene (LIG) has enabled the creation of flexible sensors for emerging applications such as wearable electronics and intelligent systems. Although LIG can be designed to be a sensitive strain sensor due to the large change in its resistance under deformation, this property can also limit its use as a printed conductor on flexible substrates. Here, we present a versatile technique to enhance the electrical conductivity and resistive heating ability of LIG for use as flexible conductors in printed electronics. The highly conductive traces are prepared by direct writing of LIG onto a polyimide film using a CO2 laser, upon which the functionalized liquid metal (LM)—eutectic gallium indium (EGaIn)—particles are deposited and activated. This results in a ∼400 times increase in electrical conductivity of LIG traces while maintaining mechanical flexibility and manufacturing scalability without the need for soldering. Electromechanical characterization of the LIG-LM traces shows low resistance change (less than 0.3 Ω) under large bending deformations. At the same time, the enhanced electrical conductivity contributes to the resistive heating performance as it reduces the input voltage requirement by ∼15 times to achieve similar surface temperatures compared to pure LIG traces. By combining EGaIn LM with laser-synthesized graphene, we can fabricate flexible hybrid electronics. We demonstrate the practicality of this technique by fabrication of flexible conductors and heating devices with highly customizable patterns.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2023-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Highly conductive laser-induced graphene through the deposition of liquid metal particles for flexible electronics\",\"authors\":\"Halil Tetik, Emmy Markgraf, Kohya Kato, Valerie N Chan, M. Malakooti\",\"doi\":\"10.1088/2058-8585/ace26b\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The rapid and simple fabrication process of laser-induced graphene (LIG) has enabled the creation of flexible sensors for emerging applications such as wearable electronics and intelligent systems. Although LIG can be designed to be a sensitive strain sensor due to the large change in its resistance under deformation, this property can also limit its use as a printed conductor on flexible substrates. Here, we present a versatile technique to enhance the electrical conductivity and resistive heating ability of LIG for use as flexible conductors in printed electronics. The highly conductive traces are prepared by direct writing of LIG onto a polyimide film using a CO2 laser, upon which the functionalized liquid metal (LM)—eutectic gallium indium (EGaIn)—particles are deposited and activated. This results in a ∼400 times increase in electrical conductivity of LIG traces while maintaining mechanical flexibility and manufacturing scalability without the need for soldering. Electromechanical characterization of the LIG-LM traces shows low resistance change (less than 0.3 Ω) under large bending deformations. At the same time, the enhanced electrical conductivity contributes to the resistive heating performance as it reduces the input voltage requirement by ∼15 times to achieve similar surface temperatures compared to pure LIG traces. By combining EGaIn LM with laser-synthesized graphene, we can fabricate flexible hybrid electronics. We demonstrate the practicality of this technique by fabrication of flexible conductors and heating devices with highly customizable patterns.\",\"PeriodicalId\":51335,\"journal\":{\"name\":\"Flexible and Printed Electronics\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2023-07-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Flexible and Printed Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1088/2058-8585/ace26b\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Flexible and Printed Electronics","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/2058-8585/ace26b","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 2

摘要

激光诱导石墨烯(LIG)的快速简单制造工艺为可穿戴电子和智能系统等新兴应用创造了柔性传感器。尽管LIG可以被设计成一种敏感的应变传感器,因为它在变形下的电阻变化很大,但这种特性也会限制它作为柔性基板上的印刷导体的使用。在这里,我们提出了一种通用技术,以增强LIG的导电性和电阻加热能力,用作印刷电子产品中的柔性导体。高导电迹线是通过使用CO2激光器将LIG直接写入聚酰亚胺膜上来制备的,在聚酰亚胺膜上沉积并活化功能化的液态金属(LM)-共晶镓铟(EGaIn)-颗粒。这导致LIG迹线的电导率增加了约400倍,同时在不需要焊接的情况下保持了机械灵活性和制造可扩展性。在大的弯曲变形下,LIG-LM迹线的机电特性显示出低电阻变化(小于0.3Ω)。同时,与纯LIG迹线相比,增强的电导率有助于电阻加热性能,因为它将输入电压需求降低了约15倍,以实现类似的表面温度。通过将EGaIn-LM与激光合成的石墨烯相结合,我们可以制造柔性混合电子器件。我们通过制造具有高度可定制图案的柔性导体和加热装置来证明这项技术的实用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Highly conductive laser-induced graphene through the deposition of liquid metal particles for flexible electronics
The rapid and simple fabrication process of laser-induced graphene (LIG) has enabled the creation of flexible sensors for emerging applications such as wearable electronics and intelligent systems. Although LIG can be designed to be a sensitive strain sensor due to the large change in its resistance under deformation, this property can also limit its use as a printed conductor on flexible substrates. Here, we present a versatile technique to enhance the electrical conductivity and resistive heating ability of LIG for use as flexible conductors in printed electronics. The highly conductive traces are prepared by direct writing of LIG onto a polyimide film using a CO2 laser, upon which the functionalized liquid metal (LM)—eutectic gallium indium (EGaIn)—particles are deposited and activated. This results in a ∼400 times increase in electrical conductivity of LIG traces while maintaining mechanical flexibility and manufacturing scalability without the need for soldering. Electromechanical characterization of the LIG-LM traces shows low resistance change (less than 0.3 Ω) under large bending deformations. At the same time, the enhanced electrical conductivity contributes to the resistive heating performance as it reduces the input voltage requirement by ∼15 times to achieve similar surface temperatures compared to pure LIG traces. By combining EGaIn LM with laser-synthesized graphene, we can fabricate flexible hybrid electronics. We demonstrate the practicality of this technique by fabrication of flexible conductors and heating devices with highly customizable patterns.
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来源期刊
Flexible and Printed Electronics
Flexible and Printed Electronics MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
4.80
自引率
9.70%
发文量
101
期刊介绍: Flexible and Printed Electronics is a multidisciplinary journal publishing cutting edge research articles on electronics that can be either flexible, plastic, stretchable, conformable or printed. Research related to electronic materials, manufacturing techniques, components or systems which meets any one (or more) of the above criteria is suitable for publication in the journal. Subjects included in the journal range from flexible materials and printing techniques, design or modelling of electrical systems and components, advanced fabrication methods and bioelectronics, to the properties of devices and end user applications.
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