从焊料表面张力模型得出的多芯片模块平面度要求

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2017-11-03 DOI:10.4071/IMAPS.526636

T. Marinis, J. W. Soucy

引用次数: 1

摘要

多芯片模块和扇出封装中的管芯和布线层的数量一直在稳步增加，这加剧了保持模块平面性以实现互连的问题。。。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Multichip Module Planarity Requirements Derived From Solder Surface Tension Models

The number of die and routing layers in multichip modules and fan-out packages has been steadily increasing, which has exasperated the problem of maintaining module planarity for interconnect to a ...

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.