EDC工艺的粘接强度和残余应力分析

IF 2.4 4区材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS

Surface Engineering Pub Date : 2023-04-03 DOI:10.1080/02670844.2023.2233256

V. Kumaran, B. Muralidharan

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引用次数: 0

摘要

摘要本文报道了涂层厚度对铜（Cu）镍（Ni）粉末冶金（P/M）电极镁合金表面放电涂层（EDC）工艺的粘附性能和残余应力的影响。通过光学显微镜测量复合涂层厚度，其范围为10.2至102.4 µm。用场发射扫描显微镜（FESEM）和能谱仪（EDS）对涂层进行了表征。通过X射线衍射（XRD）和傅立叶变换红外光谱（FTIR）对其化学成分和官能团进行了鉴定。残余应力通过ETA衍射仪进行评估，结果显示压缩残余应力在−458范围内增加 ± 118 MPa至−1078 ± 125 MPa，拉伸残余应力从656降低 ± 113 MPa至27 ± 11 MPa。通过划痕试验测量临界载荷。结果表明，涂层表面的粘合强度随着层厚度的增加而提高。

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Analysis of adhesion strength and residual stresses developed by the EDC process

ABSTRACT This paper reports the effect of coating thickness on adhesive properties, and residual stresses by the electric discharge coating (EDC) process on Mg alloy with copper (Cu) nickel (Ni) powder metallurgical (P/M) electrodes. The composite coating layer thickness was measured by optical microscope and it ranges from 10.2 to 102.4 µm. The coating layer was characterized by a Field emission scanning microscope (FESEM) and Energy-dispersive spectroscopy (EDS). X-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FTIR) analyses were made to identify the chemical composition and functional group. Residual stresses were evaluated by an ETA diffractometer and it revealed that compressive residual stress increases with a range of −458 ± 118 MPa to −1078 ± 125 MPa and tensile residual stresses decrease from 656 ± 113 MPa to 27 ± 11 MPa. The critical load is measured by scratch test. The result shows the adhesive strength of the coated surface was improved with an increase in layer thickness.

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来源期刊

Surface Engineering 工程技术-材料科学：膜

CiteScore

5.60

自引率

14.30%

发文量

审稿时长

2.3 months

期刊介绍： Surface Engineering provides a forum for the publication of refereed material on both the theory and practice of this important enabling technology, embracing science, technology and engineering. Coverage includes design, surface modification technologies and process control, and the characterisation and properties of the final system or component, including quality control and non-destructive examination.