用于WLAN和WIMAX应用的双频带微带半圆槽贴片天线

IF 0.5 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Radioengineering Pub Date : 2022-09-01 DOI:10.13164/re.2022.0406

M. Mushtaq, S. M. A. Shah, S. Munir, M. Hussain, J. Iqbal, U. Khan

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引用次数: 0

摘要

。分析并提出了一种适用于WIMAX和WLAN的双频微带天线。为了提高天线的带宽和增益，该天线在贴片中加入了半圆缝隙，并采用了缺陷地结构技术。利用计算机仿真技术(CST)软件对其性能特性进行了设计和仿真。所提出的天线尺寸为28 × 26。6𝑚𝑚在3.4 GHz和5.5 GHz的中心频率下，天线的反射系数分别为-48 dB和-44.5 dB。天线的增益分别为2.72 dB和3.87 dB，适用于WLAN和WIMAX应用。模拟结果与实测结果吻合良好。这些结果证实了该天线在WLAN和WIMAX应用中是非常有前途的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Dual Band Microstrip Semicircular Slot Patch Antenna for WLAN and WIMAX Applications

. A dual band microstrip antenna for WIMAX and WLAN applications is analyzed and presented in this paper. The proposed antenna has semicircular slot in patch and Defected Ground Structure (DGS) technique for the im-provement of its bandwidth and gain. Computer Simulation Technology (CST) software is used to design and simulate the performance characteristics. The proposed antenna has the dimensions as 28 × 26 . 6 𝑚𝑚 2 . The fabricated antenna provides a good reﬂection coeﬃcient of –48 dB and –44.5 dB at a center frequency of 3.4 GHz and 5.5 GHz. Gain achieved by the antenna is 2.72 dB and 3.87 dB for WLAN and WIMAX application. Good agreements have been found between simulated and measured results. These results conﬁrm that the fabricated antenna is very promising for WLAN and WIMAX applications.

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来源期刊

Radioengineering 工程技术-工程：电子与电气

CiteScore

2.00

自引率

9.10%

发文量

审稿时长

5.7 months

期刊介绍： Since 1992, the Radioengineering Journal has been publishing original scientific and engineering papers from the area of wireless communication and application of wireless technologies. The submitted papers are expected to deal with electromagnetics (antennas, propagation, microwaves), signals, circuits, optics and related fields. Each issue of the Radioengineering Journal is started by a feature article. Feature articles are organized by members of the Editorial Board to present the latest development in the selected areas of radio engineering. The Radioengineering Journal makes a maximum effort to publish submitted papers as quickly as possible. The first round of reviews should be completed within two months. Then, authors are expected to improve their manuscript within one month. If substantial changes are recommended and further reviews are requested by the reviewers, the publication time is prolonged.